Electronics Forum | Wed Sep 14 15:42:45 EDT 2011 | nowak18
During temperature cycling we have determined that the conformal coating wicking underneath our BGAs has caused fractures in our solder balls. One proposed solution is to run an RTV dam around the parameter of the BGA to prevent the CC from wicking u
Electronics Forum | Tue Sep 20 08:53:13 EDT 2011 | jocelynlauzon
My company is looking for an IPC expert consultant in BGA underfilling to support an important contract that is being prepared. We are looking for someone with hands-on experience with large (~2"x2", with as much as 1800 pin, 1mm pitch, 0.5mm ball di
Electronics Forum | Sat Dec 24 19:39:43 EST 2011 | dontfeedphils
I've reflowed many different size BGA's in an effort to better the connection and to help the board pass functional test. Using a middle of the road liquid flux and a convection spot rework machine and almost every time I would reflow a failed board
Electronics Forum | Wed Apr 04 08:55:45 EDT 2012 | tombstonesmt
Dave, *The machine looks to keep a steady 290c (I can confirm) *This problem is machine/product specific. We have three other Pillarhouses that run the same alloy/flux but only run this one product at this station. *The solder does have a "tail" whil
Electronics Forum | Wed Aug 15 19:55:46 EDT 2012 | hegemon
If you are doing X-Ray post place and pre-reflow you should be good. Look elsewhere. Check profile - full lead free or hybrid? Be sure you are acheiving the required reflow temps and TAL required for the solder paste too. Check for belt movement
Electronics Forum | Tue Sep 04 09:38:38 EDT 2012 | cobham1
The best thing you can do is to clean the board that has a solder paste defect on it. If you don't you probably will have issues after reflow. This could include bridging, raised parts, or any number of issues. You need to remember that if you are re
Electronics Forum | Wed Sep 26 11:42:19 EDT 2012 | comatose
I have an ap-25 and wish i had gotten the UP-2000 instead. How's that for an answer? The main difference is that the ap-25 uses linear motors and air bearings, whereas the up-2000 uses ball screws. The linear motors are faster, but the whole thing i
Electronics Forum | Wed Dec 05 18:28:54 EST 2012 | cnotebaert
what type of part is this a micro BGA by chance? there is a mill spec (man I cant remember it right now), I'll get back to you! it provides acceptance criteria for chip/crack/gouges.... if it doesn’t expose the lead frame (inner workings of the devic
Electronics Forum | Tue Dec 11 11:59:00 EST 2012 | sarason
The issue is surface tension around the connector. Your tip needs to have more surface tension than the pins of the connector as it forms a cluster when being soldered. When I used to solder superfine connectors with a metcal iron it had a horses hoa
Electronics Forum | Fri Jan 18 12:34:14 EST 2013 | duchoang
Yes, I have. think I have pretty good reflow profile. We use Lead-Free,No-Clean,SAC305 Solder Paste. The problem is at LGA design.The pad size is alot bigger than BGA. They are totally flat and do not have balls/spheres which melted and collapsed thr
