Electronics Forum | Thu Aug 02 17:56:27 EDT 2001 | jporter
We are considering having some BGAs packages re-balled. Where can I go to find out more information on this process? Especially, any adverse affects on the long term functionality of components subjected to this process. Thanks.
Electronics Forum | Mon Jan 17 10:55:44 EST 2000 | Dave F
Interesting point Mark. We prefer solder mask between pads to reduce bridging. How does removing solder mask between pads eliminate solder balling? Thanks Dave F
Electronics Forum | Fri Dec 17 10:05:59 EST 1999 | Victor Salazar
You might want to check your paste application. We eliminated this problem with reduced aperatures, and homeplate designs on our stencil. The paste process is very important in eliminating solder balls. See Solder aperature guidlines in the forum.
Electronics Forum | Mon Aug 16 05:42:53 EDT 1999 | Omat Marasigan
Hello reflow experts, I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. thanks in advance.... ...Omat
Electronics Forum | Thu Aug 12 04:52:04 EDT 1999 | Omat Marasigan
Hello everyone, I would like to know more about the so called FACETED or "Mirror ball" surface apperance. Its cause and how to eliminate / corrective actions for it. pls. help... thanks and best regargs, ...Omat
Electronics Forum | Wed Aug 04 15:05:17 EDT 1999 | Tom B.
Hello Netters, Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? Thanks for any help Tom B.
Electronics Forum | Thu Jul 08 12:47:02 EDT 1999 | Mark
| Any recommendations for a reballer for BGA and mBGA? Low volume, low cost appreciated! | | There is a large article in the current issue of Circuits Assembly magazine that says properly re-balled BGA's are perfectly fine. Also there is a re-bal
Electronics Forum | Wed Feb 17 16:39:05 EST 1999 | 3D
What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same.
Electronics Forum | Mon Jan 11 16:16:52 EST 1999 | Jenna Sweterlitsch
This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? Thanks!
Electronics Forum | Fri Oct 16 09:46:32 EDT 1998 | Bob barr
I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? Tha
