Electronics Forum | Wed Dec 06 21:36:13 EST 2006 | davef
It's surprising that you have that much copper. Copper contamination of leadfree is usually tolerable up to 1%. So, the copper is moving from the pad to the solder ball. Right? If that's correct, the pad requires a buffer material between it and
Electronics Forum | Sat Mar 24 07:50:04 EDT 2007 | davef
It's possible that 90/10 is being replaced by LF in many ball suppliers' [Alpha Metals, Kester, AIM] inventories.
Electronics Forum | Thu Jul 12 16:17:59 EDT 2007 | bandjwet
We are looking for: 1. A company that sells inspection equipment that can measure the height of solder balls (relative to the plane of the interposer or bottom of the device) OR 2. A service provider who can make some measurements for a user. Any
Electronics Forum | Thu Aug 23 22:41:54 EDT 2007 | davef
Water soluable fluxes are quite hydroscopic. If you keep RH below 50 percent, solder balling caused by humidity should be minimized.
Electronics Forum | Fri Aug 24 09:29:08 EDT 2007 | jgrootkoerkamp
Solder balls with wave soldering can have different causes. The two most important are the solderresist and the flux. I have similar problems, after changes the flux type 90% off all solderballs are gone. KR, Joris Groot koerkamp
Electronics Forum | Fri Aug 24 12:39:59 EDT 2007 | hussman
I would say no, unless your machine is in extremeconditions. You may want to check your flux / preheat out as well. If you are leaving a lot of flux on the board at wave, it may be boiling - which can cause solder balls.
Electronics Forum | Thu Nov 01 22:32:57 EDT 2007 | lvzhu
CSP has pillow, the BGA's ball doesn't combination with the solder paste. also ,the 0402 chip aftet the oven ,the surface looks like many tin ball pile together. how solve this problem. thanks for your discuss.
Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla
I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.
Electronics Forum | Mon Aug 11 10:37:19 EDT 2008 | realchunks
I assume you mean the balls of the BGA, not pads (laugh it up guys - I said balls). If so, you may have a no-lead BGA or a high temp BGA.
Electronics Forum | Thu Oct 16 08:41:21 EDT 2008 | davef
We don't associate solder balls with no-clean flux and humidity. For solder balls with no-clean flux, we'd rather have you thinking about: * Paste selection * Aperature size * Paste print process * Reflow recipe
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