Electronics Forum | Tue Jan 12 19:07:07 EST 1999 | Earl Moon
| | For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? | | | | It appears to me that there are two options: | | A: to have a pn chart bas
Electronics Forum | Tue Jan 12 21:42:33 EST 1999 | Jon Medernach
What's important in stencil printing (which differs from screen printing) is providing a consistant volume of paste at each interconnect. The process window varies in proportion to the pitch. More than 60% of all defects are related to solder depos
Electronics Forum | Tue Jan 12 10:18:36 EST 1999 | Russ Steiner
| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp
Electronics Forum | Tue Dec 29 12:18:17 EST 1998 | Ryan Jennens
| | I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. | | | | Is there any one who has been running this process in production ? | | | | Yes I do mean
Electronics Forum | Wed Dec 23 22:00:50 EST 1998 | Phillip Hunter
| Many machines now have adaptive pick that helps tune in the pickup as the 0402 part moves around in the pocket. Fuji may have a feature like this, but I think they adapt the pickup in only one axis (by adjusting the feeder rack). Unfortunately th
Electronics Forum | Wed Dec 16 11:18:24 EST 1998 | Jason Gregory
I did see the Amistar at NEPCON Texas and it appears to be a fine machine. The multi-heads and vision-on-the-fly is nice. Feeder capacity seems to be a concern, though. Ibelieve it holds 120 8mm feeders and if you purchase a tray sequencer, it takes
Electronics Forum | Thu Dec 03 13:39:52 EST 1998 | Russ M
| | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure
Electronics Forum | Mon Nov 09 22:33:42 EST 1998 | Jim McCarten
I have had experience with both companies. If you are doing contract work and get you parts and boards in a box, the Mydata does a fine job of teaching a board on the machine. Quad's strengths are in their software and the ability to automatically
Electronics Forum | Wed Nov 11 06:59:20 EST 1998 | Jim Mitchell
Scott - Good to see things are going well for you. With regard to your comments, Quad has introduced a complete line of Semi-conductor/APT machines (Q Series) that support both SMT and Semi-conductor applications. The machines were introduced in 19
Electronics Forum | Mon Nov 02 13:24:18 EST 1998 | Ryan Jennens
| Well my process is I'm running my belt speed at 3.50fpm and about 215 to 225 degrees top side. I got my main wave down to a little less than half the board thickness. I'm not using a hot air knife cause we thought it might create more of a problem
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