Electronics Forum: base (Page 71 of 313)

Convection Oven Reflow Modeling Simulations

Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno

Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.

DIP Conformal Coating

Electronics Forum | Fri Feb 11 16:34:01 EST 2000 | Chris McDonald

Does anybody have a source for jigs/tanks for a manual dip operation? We are stuck conformally coating PCBs manualy and the volumes do not justify us buying a 100k automated machine. there for we have to manually dip the pcb in a silicon based coatin

Re: Black spot on Gold Pads

Electronics Forum | Tue Nov 28 21:07:44 EST 2000 | Alvin K

Gold is porous and spots on gold plated PCBs is one of the drawbacks of using gold as a solderability protector. Base Nickel exposure seems to be the cause of this and is aggravated when the gold thickness is less than what it should be. I agree with

Re: High Temp Solder Application

Electronics Forum | Thu Nov 09 01:17:28 EST 2000 | DL

John, Ahhhh the possibilities. Have you considered the dissipative properties of available substrates? A ceramic (excellent heat dissipation) based substrate could be a possibility for future designs. Maybe there are surface mount parts out there fo

Re: How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Wed Sep 27 19:53:17 EDT 2000 | Dave F

Melbourne Ozzies: Have you been to any Olympic events? 2X Payscale: Why not just hire a worker to fill-in for the additional time? Dispenser vs Printer: I'm amazed. Please send me your analysis. I'd love to justify a dispenser, based on numbers.

Re: Stencil Cleaner

Electronics Forum | Tue Aug 29 10:04:50 EDT 2000 | Dave

Francois, It appears from "G's" admission in his earlier posting that his "study" was based on the evaluation of 2 pieces of equipment - one high pressure spray system and one ultrasonic system. There are other alternatives...low pressure, high volum

Re: Shorts in corners of BGA devices

Electronics Forum | Fri Jun 23 10:01:35 EDT 2000 | Bob Willis

A couple of weeks back I produced a video clip for Metcal to show what happens when BGA pop or the edge of the base warps causing shorts to form. Its 2.3meg if there is enough interest in seeing this I will put it up some where for download. Bob Wil

Re: BGA PLACEMENT

Electronics Forum | Thu Jun 29 10:40:14 EDT 2000 | Scott Schrieber

There are Companies that do this type of inspection for you if you don't have x-ray equipment. We used a company called Glenbrook Technologies in New Jersey (973) 361-8866. The contact person was Steve. They supplied the film and even pointed out

Re: wave solder

Electronics Forum | Mon Jun 12 11:07:17 EDT 2000 | Jason

after reading some other problems i can tell you that we have an electrovert wave and are using alcohol base flux with convection preheaters. also we are spraying it on...not foaming. we are using an omega wave also. thanks again...if you need mor

two station intercom

Electronics Forum | Sat May 20 06:49:08 EDT 2000 | dave

I'm studying electronics at Manchester and I'm building a two station intercom based on an lm386. I have all the components to build it, but could do with some in depth technical imformation to impress my lecturers when I'm explaining how it works. P


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