Electronics Forum: basing (Page 246 of 312)

Re: I'm looking to find a traning course for PCB design & layout

Electronics Forum | Fri Feb 13 12:48:24 EST 1998 | Scott Cook

| Hi! | I'm looking to find a training course for PCB design | & layout. It would be prefer to be in Canada, if such | courses are available here... if not I'll go where ever | I have to. | The course should be about the following points or | more: |

Re: I'm looking to find a traning course for PCB design & layout

Electronics Forum | Mon Mar 30 01:08:12 EST 1998 | terri

| | | Hi! | | I'm looking to find a training course for PCB design | | & layout. It would be prefer to be in Canada, if such | | courses are available here... if not I'll go where ever | | I have to. | | The course should be about the following poin

Re: Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly.

Electronics Forum | Wed Jan 21 03:44:04 EST 1998 | Igmar

| We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interested

Wave Soldering Ceramic PCB's

Electronics Forum | Thu Aug 09 16:41:12 EDT 2001 | johnw

Dave , you know it's your cheery disposoition I love.... Ok so the process: Process is Double sided reflow for SMT & PTH via the wave. Like I said or did I, I forget and can't check back...it's a spray fluxer with noclean mutlicore NR3s-06 water b

Solder Joint Strength

Electronics Forum | Tue Aug 28 16:41:42 EDT 2001 | davef

Very few concern themselves about the strength of solder connections, because it doesn�t require much strength to keep a solder connection attached to the board. More important are factors that arise as a result of the different materials properties

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Aug 28 16:44:27 EDT 2001 | davef

Several points are: * Some may argue that DPMO is peculiar and specific. That�s why IPC-7912 states �Users of this document are cautioned when comparing one manufacturer�s indices to one another due to differences in assembly complexity and the amou

glue measurement

Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand

Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.

Commercial Postings

Electronics Forum | Wed Sep 26 17:13:55 EDT 2001 | kenbliss

It seems to me that this site is most helpful if anyone can supply a solutiion rather than just an idea to solve a persons problem. In many cases a simple piece of equipment or adjustment to a piece of equipment will solve a problem that the person

Print Parameters

Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake

Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point

0201 solder beading

Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake

I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th


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