Electronics Forum | Thu Apr 05 12:45:45 EDT 2001 | Claude_Couture
On mixed technology PCBs, we find numerous blow holes on the solder joints of radial parts (electrolytics, LEDs, etc). The solution that works so far is to cut the leads very long in the radial inserter so that the part is kinda loose and the air in
Electronics Forum | Thu Apr 05 22:27:06 EDT 2001 | davef
As a band-aid, consider running your chip wave when soldering these boards [Similar to Cals "dance with me babe" suggestion.] If the problem is as broad based as you say and the radial components have a tight fit, consider increasing the holes by a
Electronics Forum | Fri Apr 13 22:38:19 EDT 2001 | edylc
Hi , Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape....?? You mean , the adhesive properties of the kapton tape will cause the gold plating on the gold finger to be somehow peel of
Electronics Forum | Tue Apr 17 18:11:48 EDT 2001 | billschreiber
Adam, After a thorough cleaning, I see most of my customers using a weekly maintenance schedule. However, because the characteristics of the post solder flux will contaminate the wash solution of the stencil cleaner, some customers wait until they a
Electronics Forum | Fri Apr 20 15:27:00 EDT 2001 | jimlew
We do some aperture reductions - but it's not the 10% i'm accustomed to. Looks like it should be more than we currently do (I think we do 10% of length, but no width). Don't think we have a slumping problem, and we're not doing snap-off, only contact
Electronics Forum | Wed Apr 25 10:37:14 EDT 2001 | davef
If you heat a BGA too quickly, the corners of the device will curl towards the ceiling [potato chip], because they come to temperature faster that other areas. Adding to this, thinner substrates tend to potato chip more and faster than thicker subst
Electronics Forum | Tue Apr 24 12:56:39 EDT 2001 | Steve
We are experiencing a fair amount of skewed components, mostly 0805 resistors and capacitors, during the reflow process. We have pretty much ruled out the pick-n-place and have determined that it may be happening because of variables at the paste scr
Electronics Forum | Wed Nov 29 08:33:05 EST 2000 | Dave F
No, the specific question is on the "Soldering & Rework" disk. Yours is a good approach to updates. [No lakeside baronal mansion, eh???] I have sent a list of unusual questions to Evelyn that includes the above example. It's difficult to document
Electronics Forum | Tue Sep 19 09:34:33 EDT 2000 | Erick Russell
There are two places where Laser Soldering is used for rework. One is the low volume, high mix environment where the board value is high. The other is the high volume (regardless of mix) facility where fast process time and quick set-up is required.
Electronics Forum | Thu Jul 20 12:19:24 EDT 2000 | Dave F
Bob: Techniques for removing RFI / RF shields vary according to the size and type of shield. Removing: * PTH RFI / RF shields is as straight forward as the next heat sinking PTH component, often using a solder bath or fountain. * Small SMT RFI /
