Electronics Forum: because (Page 416 of 444)

Re: Popcorn @ reflow

Electronics Forum | Fri May 21 15:40:58 EDT 1999 | JohnW

| | | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | | | your help is greatly appreciated...thanks | | | | | | omat marasigan

Re: Pin-to-paste

Electronics Forum | Fri May 07 08:06:03 EDT 1999 | Hon Choi

| | Hi all, | | | | We're starting up tests for pin-to-paste and, well, things could be better. We're testing different pastes and we're testing different apertures rules and, well, we're still testing. It's coming close and we're getting pretty

Re: White Tin

Electronics Forum | Wed Apr 28 12:48:02 EDT 1999 | Justin Medernach

| | | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | | | We are considering trying boards with White Tin so

Re: Why not use lead-free plumbing solders in electrical applications?

Electronics Forum | Fri Apr 30 09:32:42 EDT 1999 | Steve Gregory

| | |Hi all | | This Debate on lead free soldering is really hotting up here in Europe. From 2004 the use of lead in components and assemblies will be banned here. Also flame retardent halogens will be banned(FR4 etc). While we all agree that we hav

Re: Moisture sensitive device processing

Electronics Forum | Mon Apr 26 12:51:45 EDT 1999 | Bob

Steve, Moisture sensitivity needs to be taken seriously. Being in the commercial end of electronics now, I am using many plastic packages. Unfortunately, moisture sensitivity processing is not black and white and it does require procedures and dis

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 20 17:56:42 EDT 1999 | Chrys Shea

| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon

| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 27 05:23:29 EDT 1999 | Earl Moon

| Dave said: | | | | So Earl, have you gone honest and haken a real job or is this a consulting project? | | | | | | TTYL | | | | | | Davebert | | | | | | | | DamnDaveBert, | | | | I know you didn't mean to insult such a sensitive one as me, bu

Re: AOI

Electronics Forum | Thu Apr 22 11:04:58 EDT 1999 | Boca

| | I had someone suggest that they weren't really necessary as long as your process is good. Is this just a way to help you keep an eye on your process? | | | | I was thinking, as we set up our line, our money would be more well spent with control

Re: Transient Voltage Suppressors

Electronics Forum | Tue Mar 16 05:11:47 EST 1999 | Charles Stringer

| | AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuard


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