Electronics Forum | Sat Jun 04 12:11:49 EDT 2011 | davef
Q1) How to identify on good or bad RF shield that could contribute to dewetting? A1) We use Alloy 770 and 752 [German silver] for our RF shields. We have never seen a solderability issue, even aged stock solders well. * Nickel Alloy 752, Nickel Silv
Electronics Forum | Tue Nov 19 21:38:39 EST 2019 | zack
Hello, The first thing that you need to do is to make process mapping about this incident, so you can exactly determine all factors and observable changes happened during 2 weeks of timeline difference. According to my experience, if all equipment
Electronics Forum | Mon Aug 16 20:19:10 EDT 2004 | Grant
Hi, We have both Vapor Phase ASSCON semi auto as well as Soltec convection inline ovens. I must say we had no end of problems with Vapor Phase. We tried everything, and just could not totally eliminate tomb-stoning completely. We would always get a
Electronics Forum | Mon Sep 06 10:21:10 EDT 2004 | pioneertechnology
Hi All We have been manufacturing lead free in the UK for about two years now in a fashion. Let me expalin. Two years ago we began to change over our wave solder machines to lead free process. We read all the articles and attended the seminars on
Electronics Forum | Sat Aug 17 18:41:29 EDT 2002 | kenbliss
Hi Brian Thank you very much for you comments, Points well taken, forgive the length of my response here, but I wanted to respond to each of your points. The Pick and Place machine �should� be the bottleneck. The reason is in my 20 years in the in
Electronics Forum | Thu Jul 20 15:08:53 EDT 2000 | Bob Willis
Yes no problem here it is in a nut shell. The sponsor of my CD ROM on this process was Loctite who specifically developed a glue for the process to cure in less than 10seconds. Have a word with these guys they may even have a few CDs. PROCESS SEQUEN
Electronics Forum | Mon May 14 09:43:37 EDT 2001 | orbotech
As the face of business changes through revolutionary factors, such as the increasing rate of outsourcing, manufacturers (especially EMS plants) will strive to fine tune their test strategies to ultimately improve and sustain product quality and to r
Electronics Forum | Tue Sep 14 21:56:34 EDT 1999 | KEVIN SIMPSON
| | Hi, | | | | Recently encountered missing components problem at the SMT process. | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. C
Electronics Forum | Mon Sep 24 17:38:18 EDT 2001 | mparker
First question - do you have a rework station? If so, are you experiencing the same type of failures there? I have successfully used no-clean on uBGA's in the past. 6 mil solder bumps, 10 mil spacing. 88 sites. Are you reusing previously soldered uB
Electronics Forum | Tue May 23 21:14:22 EDT 2006 | davef
First, where the temperatures that aare mentioned in the original post measured? Second, it sounds like the PdAg component terminations are not seeing enough heat [your soldering iron touch-up proves this]. Your 232*C peak is the absolute minimum s
