Electronics Forum: bga and pad (Page 31 of 159)

Rework and repair system suggestions

Electronics Forum | Thu Jan 27 11:45:04 EST 2005 | Mark

Based on the components mentioned, it sounds like you need a soldering station rather than a bga rework station. The equipment mentioned would allow you to rework fine pitch QFPs and BGAs. Reworking an sot-23 using one of those systems is inefficie

Nitrogen gas and Tombstone defect

Electronics Forum | Mon Nov 21 10:51:12 EST 2011 | scottp

I've never seen a good article with a definitive explanation - just speculation that the increased wetting forces due to nitrogen result in increased tombstones. My own experience is that nitrogen is a very minor contributor to tombstones and can pr

BGA's and the Fuji IP2

Electronics Forum | Thu Jul 11 18:00:34 EDT 2002 | jax

Tony, Do an archive search for "lizard". Some times all you really need is a lizard tongue. No machine is complete without one.

voids- leaded and chip components

Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris

Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks

voids- leaded and chip components

Electronics Forum | Tue Jan 13 22:07:42 EST 2004 | davef

No, there is no such information. Choices are: * Recognize that any voiding is a process indicator and that when observed, indicate a requirement for taking corrective steps. * Tell your quality people to quit looking at components other than BGA wi

CSP and BGA soldering difference.

Electronics Forum | Wed Apr 04 18:27:53 EDT 2007 | Guest

Most CSPs are BGAs. Some are sent without bumps or balls. Thjos eneed to be bumped prior to processing for best results

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 01:10:16 EDT 2007 | Haris

My SMT line does not has these facilities so would you please tell me regarding the UNDERFILL AND FLUX-DIP process and how they can be done? Thanks.

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 08:32:47 EDT 2007 | davef

Haris: On your soldering issues, we don't know the make-up of your component. We don't know the type solder balls on the component. We don't know the solder paste you plan to use. Your component and paste supplier are better sources for this type o

Parylene Coating and BGA Reliability

Electronics Forum | Mon Oct 21 11:03:15 EDT 2013 | davef

I don't know about the papers that you seek. Try: Rakesh Kumar, Specialty Coating Systems, Inc., 7645 Woodland Drive, Indianapolis, IN 46278; 317-472-1266 F317-244-1215 rkumar@scscoatings.com

Mydata TP9-2 and TP11-UFP difference

Electronics Forum | Thu Jul 18 04:06:26 EDT 2019 | artem

Thanks for the info. And what about accuracy of the placement. Are both machines able to handle the same parts or are there any differences like for small components or BGA?


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