Electronics Forum | Tue Jul 13 07:22:43 EDT 2004 | Kris
Hi Imtiaz, Can you give a brakup of the 23 components and their end mettalurgy ? Chip ?? QFP/TSOP ?? BGA ?? Aluminium Caps ?? this will determine whether you can do it or not
Electronics Forum | Tue May 17 10:01:42 EDT 2005 | russ
I have had the same problem with this supplier, we found that one mfg. place or process used a .015" piece of FR4 as the base while others had .030" Fr4, We discontinued use of the .015" and never had a problem again.
Electronics Forum | Wed Jan 02 15:32:27 EST 2008 | shrek
HA-HA-HA... Krikies. What are ya mate? A slavakian?
Electronics Forum | Wed Jan 09 19:04:48 EST 2008 | pnguyvu
5 mil thick is the max and no reduction Any question feel free give me a call @ 714-636-6211 or email me Steve@usastencils.com Regards Steve
Electronics Forum | Wed Apr 30 14:10:21 EDT 2008 | samir
Doug, yes sir there are some excellent stuff out there in the fine SMTNet archives. Here's one example: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9822&#Message39512
Electronics Forum | Thu May 01 21:17:38 EDT 2008 | davef
The concern about lead contamination of lead-free solder has to with zone refining. For more, look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=30315
Electronics Forum | Thu May 01 21:47:12 EDT 2008 | dphilbrick
Took a couple of jumps to other threads but it was there http://www.mot.co.jp/about/ehs/green/ENV_PBFREEOV.pdf This document was exactly what I needed to send to my paranoid customer! Thanks again!
Electronics Forum | Tue Aug 11 18:15:11 EDT 2009 | ysutariya
Have you looked into Sipad? They will pre-paste your BGA and other component areas with solderpaste that has an adhesive on it. You can then hand place your components and run through a reflow. Here's their site: http://www.sipad.com/
Electronics Forum | Wed Aug 12 08:41:34 EDT 2009 | dwl
Hand placing 200,000-400,000 components, including BGA's a month does NOT sound like fun....
Electronics Forum | Wed Apr 06 13:43:14 EDT 2011 | mosborne1
ENIG is the way you need to go. With ENIG you deposit a lot less gold. Too much gold will cause soler problems. Matt www.americancircuits.com
