Electronics Forum | Thu Oct 25 14:15:18 EDT 2012 | kkay
Yes it looks like I attached the wrong reflow profile and I'll get the new one in there. Our TAL should be between 60-90 sec over 217. I'm not sure the embrittlement would be an issue as we have seen this issue across at least 3 different board vendo
Electronics Forum | Sat Feb 02 07:07:47 EST 2013 | bandjwet
The keys to avoiding the voids we have found are: 1. Proper reflow profile 2. Proper stencil design 3. Prebumping using either a metal stencil or StencilMate stencils (and then using paste flux to attach later) http://www.solder.net/products/stencilm
Electronics Forum | Mon Jul 01 19:43:44 EDT 2013 | kumar_antom
Hi there, Its a lead free process and the paste that we're using is with this alloy composition : Sn,Ag,Cu,Bi,In.... Pls refer to the attached temp.profile.... This is a mirror Pcb....Same components on both A and B side.... A side doesn't have t
Electronics Forum | Mon Jul 29 15:30:45 EDT 2013 | markhoch
Nitrogen in Reflow is grossly over-rated...., in my opinion, and in the opinion of several very well known SMT Industry "God Fathers". Way too much $$$, for a slight increase in the process window. If you profile your oven specifically for your pr
Electronics Forum | Tue Feb 11 09:47:53 EST 2014 | spoiltforchoice
Perhaps a photo of the faults you are encountering might shed some light on the issue. I would think it would take some extremely poor paste handling or paste for the paste itself to be the root cause of what you seem to be describing. I would be inc
Electronics Forum | Thu Apr 17 07:51:19 EDT 2014 | emeto
Opens are on the device to the PCB - mainly on the edges, that makes me think I get some kind of warping,but even if I bake parts and boards doesn't help. We also tried different reflow profiles - same results. I hear that some people use dip fluxers
Electronics Forum | Mon Jun 09 09:52:10 EDT 2014 | swag
Yes, jsd.jwww it can be seen right after reflow. I read back thru the spec sheet and under "soldering conditions" is says "temp. at cap surface" so thanks, SteveO I think you hit the nail on the head and we'll have to revisit the profile and target
Electronics Forum | Mon Aug 25 02:57:43 EDT 2014 | arjunkolavara
We are in the process of qualifying our SMT lines for the High Melting Point Solder with alloy composition of 93.5 Pb 5 Sn 1.5 Ag.If any one has already an experience with this alloy,kindly do give ur inputs on the process of profiling . The reflow d
Electronics Forum | Mon Mar 16 12:44:36 EDT 2015 | proy
soldering a very simple board in a very simple Accuheat oven. Can anyone give me basic starting point settings (conveyor speed and temperature) then we will profile using a mole from there. Paste 1) Tin Lead Paste 2) Chipquik low temp TL 165C PR
Electronics Forum | Fri Oct 09 12:35:30 EDT 2015 | gregoryyork
Thanks for the profile Ive also managed to get onto a proper computer and look at the images again. Where has all the flux gone?? You arent over pressurising the blades too much causing the flux to shearaway from the joint are you?? Do you have good
