Electronics Forum | Mon Jun 21 08:01:38 EDT 2010 | jm
Hello, need some help if anyone has any insight on this issue. Ran first side and ex-ray indicates BGA parts look normal. Ran the second side and now the BGA balls on first side appear to have broken free and moved under part. This board has BGA's
Electronics Forum | Fri Jun 25 07:33:23 EDT 2010 | CL
Good Morning JM, Does anything come into physical contact with the BGA in question during the reflow event? Is this a RoHS process? If so, is the BGA in question also a RoHS part? Thanks Chris
Electronics Forum | Fri Jun 25 13:52:51 EDT 2010 | tate350
Are there any tantalum caps near the BGA? I have seen "wet" tant caps releasing moisture during reflow and disrupting the BGA balls. It may result in missing balls or bridging.
Electronics Forum | Mon Jul 06 18:00:16 EDT 2015 | jwqc
Does any one know how to calculate BGA height change after reflow oven? I guess the calculation will be based on the component size, weight, ball diameter and ball count of the BGA, but how to get the actual height?
Electronics Forum | Wed Oct 04 16:30:12 EDT 2006 | russ
I hope you are not trying to melt the Ceramic BGA columns. these are not meant to melt. I would run a lead process at peak temp of 225 -230C with lead paste. The board warpage may be of design issue or Manufacture issue. Russ
Electronics Forum | Mon Jun 02 19:41:41 EDT 2008 | operator
Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of
Electronics Forum | Mon Aug 11 17:42:52 EDT 2003 | Kris
How can one go about defining the complexity of a PCB for characterizing reflow profiles A large balanced board may be easier to profile than smaller unbalanced board ? Any ideas how to define an index to calculate the complexity based on size,weig
Electronics Forum | Fri Aug 15 16:00:53 EDT 2003 | Cameron
Take a look at the product here: http://www.kicthermal.com/products/KIC-Auto-Focus.pdf KIC uses a previously profiled product library to calculate in spec reflow profiles for new products. Just enter you dimensions and if finds a solution for you.
Electronics Forum | Wed May 21 04:50:51 EDT 2008 | aj
Hi all, We had similar problems a while back. Boards would fail at test but if you applied pressure to the BGA they would pass. Turned out that during the PTH assembly process the Operators were flexing the cards during the insertion of an Oupin C
Electronics Forum | Wed Oct 04 15:06:57 EDT 2006 | C.K. the Flip
Hmmm.. you are in a pickle then. I have AIM's "Reflow Profile Supplement" where they recommend a Low-Long-Soak (LSS) profile for situations like your's. It's an old-school type profiling approach where you ramp up to 120*C for about 1 min. then soa
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