Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Wed May 24 15:59:34 EDT 2006 | JohnM
I have a product with mixed in Pb free and Pb BGAs. I decide to use SnPb paste with Pb free reflow profile to make it work for both types of BGA. Do I have a reliability solder joint issue by using this method? How is your opinion on this case? Can
Electronics Forum | Tue Feb 03 14:19:29 EST 2009 | grics
I would agree if you have a board to setup the process. But sometimes this doesn't work... If for some reason if the customers AVL has a Lead Free BGA and I am running Leaded paste (yes this really happens!), you will need to run hotter to get your
Electronics Forum | Fri Jan 07 03:34:12 EST 2011 | rpatel28364
Hi Smarts We are having difficulty in reflowing BGA wiht ROHS process on double sided board. We have tried profiling un populated board and profile is meeting upper spec of solder paste. but our customer is saying they have to heat up BGA and board s
Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah
Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad
Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG
Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w
Electronics Forum | Tue Jul 18 00:15:37 EDT 2023 | hazira1991
Is a fresh lot. This bga is old date code 2010. we had received this BGA 2021 and the baking process is done during receiving time. Production received with vacuum seal , its very hard to tell how the BGA handling and stuff and the BGA already EOL. I
Electronics Forum | Thu Nov 03 10:33:04 EST 2005 | Samir Nagheenanajar
I've read all the SMTNet threads available on this topic, been to a couple seminars, and read some articles, and the general consensus seems to be "it can be done, but shouldn't." However, at my company, we have a Pb-Free (SAC alloy) 256 IO BGA comi
Electronics Forum | Wed Aug 09 09:54:36 EDT 2006 | russ
Use ENIG, plated finish will be too thick and make for a brittle joint. ENIG is self limiting so this condition cannot be present. To ensure that the bond is strong for BGA you must ensure that process is under control. The correct reflow profile w
Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
