Electronics Forum | Sun Jan 09 19:37:15 EST 2005 | Bob R.
I'm just thinking out loud here with no experience to back it up, but I could see where you're trapping air or solvent filled voids inside the via by tenting from both sides. When you go through a heat cycle like reflow or wave solder you could be e
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
Electronics Forum | Mon Jun 13 07:44:15 EDT 2005 | bandjwet
Peter: Based on our company's experience with removing a variety of different coatings, including parylene, the BGA's can be removed. We would use a chemical etch followed by a neutralizing process. We would then reflow the devices and pry them off
Electronics Forum | Thu Aug 25 09:56:08 EDT 2005 | james
I ran a profile on a dummy board with no parts and the peak temp is 220. The 220 is just the temperature of the board of course. With that BGA on it, I am pretty sure it sucks up alot of the heat. Also I am looking at the profile and notice that i
Electronics Forum | Fri Jan 13 13:43:51 EST 2006 | russ
As far as I have determined, the Gel and Tacky are the same animal. Just flux works well, I did forget to mention that this flux only method will not work with a CCGA (Ceramic Column Grid Array) since these columns are not meant to be reflowed.
Electronics Forum | Tue Apr 25 16:42:00 EDT 2006 | russ
Sometimes you gotta do what you gotta do! We have to perform this on occasion as well. We perform this when we cannot get a board to stay free of tacoing, oilcanning, sagging or warping. (we needed a bigger preheater dimension wise) We have one no
Electronics Forum | Thu Sep 07 08:50:45 EDT 2006 | Grant
Hi, We have seen a slight rise in failures in a product, and on investigation, the BGA ball has cracked off the PCB. It's below the intermetalic layer in the ball. Reflow otherwise looks good, and the raw components are clean. I am wondering what c
Electronics Forum | Wed Jan 03 10:34:18 EST 2007 | dphilbrick
Your failure rate should be as good or better than any other leaded part on your board. Have you done a reflow profile on this board. We typically sacrifice a board and drill a hole from the bottom and then imbed a probe under the part to get the tem
Electronics Forum | Wed Jan 17 15:13:24 EST 2007 | jaime39
When placing the part to be reflow try applying heat to the board from the secondary side until the primary side has a temperature of about 130 degrees celcius. Following this procedure it should minimize the heat exposure of the part being soldered.
Electronics Forum | Thu Jan 18 15:47:52 EST 2007 | Jeff
>What was your package temp during this reflow process? I >>know you had balls at 245 but what about the case itself? I did not measure the temperature of a package. My thermocouples are 36AWG - around 0.01" diameter, so about the only way I imagine
