Electronics Forum | Tue Apr 13 09:46:39 EDT 2004 | davef
Now, that's different. We misunderstood the problem from your original descrtiption. We thought the voids were showing at the via in the pad. Now, we understand the voids appear to be in the solder balls. Suggestions are: * Search the SMTnet Arch
Electronics Forum | Sun Dec 26 21:18:04 EST 2004 | tellinghuisen
Chris, We also do not allow the use of Lead-Free BGAs in a lead based process. It is actually one of the things that scares us most about converting to Pb-free. Most of the suppliers that we have talked with are planning on moving to the SAC
Electronics Forum | Wed Aug 24 10:07:56 EDT 2005 | stepheniii
I think where the fuzzy thinking starts is by calling the recipe's; profiles. Or maybe I"m being too fussy. Idealy you want every solder joint to have the same thermal "profile" (not recipe). That is the temperature over time is best if identical fo
Electronics Forum | Wed Jan 24 11:24:07 EST 2007 | ruggi
I'm probably not telling you anything you don't already know, but a technique that's worked very well in the past for me is to methodically step through every part of the process and observe your boards being built, or take a scrap or simulated one a
Electronics Forum | Mon Aug 10 15:15:17 EDT 2009 | indity
I have very little knowledge of pick and place machines or assembly, and was hoping someone could give me some advice of where to start looking. I do learn quickly so I am not afraid of challenges or learning through mistakes. I need to produce abou
Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
Electronics Forum | Mon Apr 19 15:45:21 EDT 2010 | dwonch
Thanks to all for your input. We did have a third party do an analysis on boards from the first shop. They were shipped directly from the board shop to eliminate the possibility that we could contaminate them. The third party (Forsite) did find Sili
Electronics Forum | Mon Jun 13 07:20:10 EDT 2011 | scottp
It's more likely the warp is due to material issues. I've spent way more time than I'd care to admit running Thermoire with various profiles and there's pretty much nothing you can do to reduce warp via profile unless your current profile is truly a
Electronics Forum | Fri Jun 15 22:00:23 EDT 2007 | grantp
Hi, Thanks for the reply guys, and this is interesting information. I had assumed that if we had a paste spec, and this was the spec for the solder to reflow correctly, then if I achieved that spec, the solder should perform correctly. However this
Electronics Forum | Thu Dec 11 09:57:38 EST 1997 | Alan Brewin
Thanks to Scott for your reply, much appreciated. Are you aware of any new developments in this area? Particularly in respect to the solvents? We are aware that fluorine chemistry is now in-use with amazingly high boiling points. We understand that
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