Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto
This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.
Electronics Forum | Thu Jun 18 14:25:21 EDT 2020 | sara_pcb
We have observed Plastic BGA crack in encapsulation to substrate interface. After reflow, the device was not functioning. The Crack is observed in the fresh lot during visual inspection. What is the attachment process of package to substrate? where c
Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah
Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad
Electronics Forum | Fri Mar 06 09:24:44 EST 1998 | Hector Valladares
I have been using Vapor Phase for about 5 years. We just started building our first BGA and the reflow profile is the same as most SMT assembly.We build PWA that are 25 layers thick with 0.050 heat sinks. We have done some preliminary X ray and BG
Electronics Forum | Fri Feb 09 08:07:41 EST 2007 | jax
Has the board been looked at under X-Ray? Have you built more than 1 of the boards in question? Do any of the other boards have the same problem? Have you made any changes to the profile between boards? One side of the BGA collapsing during reflow w
Electronics Forum | Mon Jul 23 05:40:58 EDT 2012 | franks
We are having a problem with a 601 pin BGA in that the corners of the BGA are lifting and taking the pads with them. Faults are not always seen straight away so we are not sure at which point the fault is happening. So far it looks as though flexing
Electronics Forum | Wed Dec 20 00:24:21 EST 2017 | jineshjpr
Can anybody suggest how to get reflow soldering datasheet of different components like BGA, QFN , QFP etc with different MPN. Nowadays almost all the datasheets are specifying only about functions alone and nowhere the data available for reflow solde
Electronics Forum | Mon Jan 03 09:58:29 EST 2005 | Dave J
One of the difficulties with BGA rework is excessive heating of the internal package (die) temperature. We have several "SRT" hot air rework systems which work well, but with Pb-Free components the challenge becomes even greater. The question I have
Electronics Forum | Tue Apr 24 10:05:09 EDT 2001 | Robert Steltman
Help please.... We have just run a prototype board using a number of BGA devices on it. The corners on two of the BGA's (PBGA357) seem to be higher than the centre of the device. ie the outer bumps seem to be "stretched" compared to the centre bumps
Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
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