Electronics Forum | Thu Mar 29 13:15:18 EDT 2007 | adrian_nishimoto
We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using liquid or tacky flux does not always ensure proper wetting of the pads. Also The BGA sits closer to the PCB making cleaning and endoscopic inspection
Electronics Forum | Wed Nov 07 17:11:14 EST 2001 | davef
1 CAN WAVE SOLDER AFFECT OR DAMAGE BGA? Sure. Since you are vague, assuming: * Partially assembled board was not stored to prevent moisture absorption. * BGA is in a plastic package. * Partially assembled board was stored long enough to exceed th
Electronics Forum | Fri Oct 22 07:24:11 EDT 1999 | Chris May
We are not into BGA Tech (yet !), but I was discussing other issues with a knowledgable individual, who said that they do not reball BGA's. What they do, is to have a piece of glass, apply some flux to the glass and then drag the BGA across the glas
Electronics Forum | Fri May 21 15:45:29 EDT 2010 | pforister
iv40, Thanks. The PCB that we are populating the BGA hybrid onto does not have holes in the vias. I think the manufacturer indicated that on their hybrid it has holes in pads. This hybrid is a PCB assembly with BGAs and other components populated
Electronics Forum | Fri Dec 18 00:48:35 EST 1998 | Mr Mariscal
I have developing a BGA Process and having problems with 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the stange thing is that it does not happ
Electronics Forum | Fri Aug 22 17:12:40 EDT 2003 | Stephen
read the other messages. I havn't seen this problem nor have I even heard of anyone seeing this problem. If anyone else has seen this on unreflowed BGA's I would love to hear it. At first I thought you meant that your QA department was finding the pr
Electronics Forum | Tue Jul 03 16:59:18 EDT 2012 | dontfeedphils
Reflowing a BGA can be a reliable and long term fix, but it has to be done correclty, and using a heat gun and going in circles around the part is definitly not the right way to do it. To do it correctly you would flux under the bga, use a rework st
Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS
IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa
Electronics Forum | Wed Oct 11 20:52:51 EDT 2006 | psgill
Guys, Any of you tried running different setting on the top & bottom side temperature on the reflow oven. I'm trying to address uBGA coplanarity issue using this method. Assume board are flat. Any inputs?
Electronics Forum | Tue Sep 11 11:40:17 EDT 2007 | shing
Please help to answer me the followings questions: 1. The optimum temperature for IC reapir (TSOP & BGA), since many IC found defective after reapir by hot air gun 2. How many time does a IC(TSOP & BGA) can pass throught the IR Reflow without defecti
