Electronics Forum: bga's (Page 146 of 546)

Cleaning Oxides from BGA's

Electronics Forum | Fri Oct 18 13:13:38 EDT 2002 | Matt

What size are the spheres? you could have them laser re-balled with no induced heat.

Cleaning Oxides from BGA's

Electronics Forum | Fri Oct 18 16:25:41 EDT 2002 | russ

Matt, please tell me more! This sound interesting Russ

Standard for BGA void

Electronics Forum | Wed Oct 23 14:44:58 EDT 2002 | mzaboogie

Hi Ben, IPC610 has a pass/fail of 25% of ball volume. Hope this helps

uBGA PCB design and stencil design

Electronics Forum | Tue Oct 22 10:23:38 EDT 2002 | davef

ubga and stencil

BGA Short

Electronics Forum | Thu Oct 31 11:21:18 EST 2002 | yngwie

Thank you very much for the valueble inputs... cheers..

BGA placement on PGA

Electronics Forum | Thu Nov 07 15:55:30 EST 2002 | Debi Musante

The XRAY looked okay with minimum voids throughout. Customer reports insufficient contact causing intermitten failures.

Solder short-BGA with thermal pad

Electronics Forum | Fri Dec 27 09:45:04 EST 2002 | emeto

what exactly do you mean by big thermal pad?

Solder short-BGA with thermal pad

Electronics Forum | Wed Feb 19 19:24:12 EST 2003 | arturoflores

Is there any way I can attach a report?

BGA voids

Electronics Forum | Mon Jan 13 18:22:55 EST 2003 | davef

100 sec) and decrease reflow temp to 205C. * Understand that voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherw

BGA PCB Pad size

Electronics Forum | Thu Jan 30 06:44:20 EST 2003 | Grant Petty

Hi, Great, thanks for the info! Regards, Grant Petty Blackmagic Design www.blackmagic-design.com


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