Electronics Forum | Fri Apr 23 07:15:44 EDT 2004 | pjc
Best systems come from the following: SRT http://www.vjelectronix.com/vjebeta/products.asp?title=Rework%20Solutions AirVac http://www.air-vac-eng.com/ Metcal http://www.metcal.com/ ERSA http://www.ersa.de/en/
Electronics Forum | Mon Apr 26 16:59:11 EDT 2004 | babe
Any concerns on the IR in melting connectors etc. simply cover the part with aluminum foil. That will prevent any heat from attacking the component. The Ersa unit is in my mind the best bang for the buck.
Electronics Forum | Tue Apr 27 16:37:16 EDT 2004 | babe
Well I would think that the heat slug would work to a point. Obviously made to dissipate heat from the component. That said it wouldn't hurt to cover that also with aluminum foil. Your not wrapping a present, your simply tenting the component. IR wil
Electronics Forum | Thu May 06 18:48:22 EDT 2004 | Dreamsniper
SUMMIT 750. My yield is 75%-98%. And they all depend on the pad design, stencil, paste, operator, thermal profile, etc. I have 98% yield on some of our products with good pad design. Process is easy to control. Dreamy
Electronics Forum | Mon May 10 16:36:16 EDT 2004 | davef
Look here: http://www.aimsolder.com/techarticles/tech%20sheet%20BGA%20voiding-%20reducing%20through%20process%20optimization.pdf We have no relationship, nor receive benefit from the company linked above.
Electronics Forum | Wed Apr 28 12:20:41 EDT 2004 | mrmaint
Paul, It is hard to tell with the bridge the shape of the shere. The balls that are not bridged look very symetrical as far as the sphere. It does not appear to be over compressed.
Electronics Forum | Sun May 02 07:36:47 EDT 2004 | mk
Use solid solder deposit for GGA's and you will not have shorts, opens, voids or need cleaning. Simple as that. mkehoe@sipad.net www.sipad.net
Electronics Forum | Tue Jun 01 19:25:19 EDT 2004 | Ken
...oops part 2: I will assume a sac 350 ball??? 217-218C this will completely reflow the ball and form a "normalized" joint with a collapsed structure.
Electronics Forum | Fri May 07 17:04:02 EDT 2004 | davef
Either method is acceptable: * No IPC approved method * Applying flux only is easier than applying paste * Paste gives a higher stand-off, which should improve reliability
Electronics Forum | Thu May 13 20:31:06 EDT 2004 | GS
Try contacting Process Sciences in Austin tx at 512-259-7070 They can do that process for you without you having to lay out a ton of $ for equipment
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