Electronics Forum | Wed Jul 09 16:00:04 EDT 2008 | grics
Obviously you wouldnt perform the most difficult rework tasks till last... Sorry. I should have clarified. We rack our units to keep good units flowing and fall out are held for rework. The line never stops. Inspection is inline and it is the deci
Electronics Forum | Fri Jul 18 14:36:17 EDT 2008 | proy
I have a QFN which we are adding after process. (it was not available the day we ran the 4 prototypes.) We have removed most of the solder on all the pads, My plan was that a LITTLE solder on the center pad would wet and center the device (using a g
Electronics Forum | Mon Sep 08 01:45:35 EDT 2008 | rameshr
1.The Temperature on the pad is 247.C & also it is an lead free profile, the same profile we have used till last lot but we had obsereved this problem earlier to this current batch. 2. Both in Type3 & Type 4 paste we are using because of we are using
Electronics Forum | Tue Sep 16 16:16:12 EDT 2008 | ck_the_flip
Yes, this scenario is fine. However, BGAs are a different story since the ball is the bulk of the solder joint. In this case, you MUST run a "hybrid profile". Look it up in the fine SMTNet archives (keyword: hybrid profile). I have "been there an
Electronics Forum | Wed Oct 08 09:25:45 EDT 2008 | dphilbrick
Kinda got that Mike but here is the problem. I have 1.8 mil parts that need to be NON-RoHS. 85% of those parts being STD R's and C's. I am looking for a place that provides at close to standard cost R's and C's with something besides pure tin termina
Electronics Forum | Mon Oct 20 11:44:41 EDT 2008 | jdumont
Good morning all, we have been having some random intermittent connections on some BGAs lately on ENIG finished boards. Can you take a quick look at this picture (link) and let me know if it looks like a possible black pad occurrence? The picture sh
Electronics Forum | Thu Oct 30 15:07:40 EDT 2008 | jemills
Hello I have a new 0402 pad design on a recent board were building in future. On closer look i thought the pad was a thru hole mount , but upon closer inspection the round pads are for 0402 comps. I had a discussion with the engineer and he said
Electronics Forum | Fri Jan 30 14:20:55 EST 2009 | scottp
I do a lot of thermal cycle testing of new components for my company and often when I lay out a test board I'm trying to simulate 4 or 6 layer boards but I don't need them for routing so I just use a solid fill of a cross-hatch pattern. I've done it
Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge
Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
