Electronics Forum | Wed Apr 09 10:17:28 EDT 2003 | ksfacinelli
http://picturecenter.kodak.com/share?invite=ZExr4tzrmmYeI5Uozhlo Here is a link to the pictures. This is a HASL board with ws-609 paste. Lead parts look good but would like to see a shinner joint in the BGA area. Thermal profile looks good 150-15
Electronics Forum | Mon Apr 28 11:23:42 EDT 2003 | David
Can anyone help me with a problem I am encountering on specifying the surface finish on a new BGA System in Package module. So far I have been advised to look at a palladium / nickel / gold solution but does that have any advantages over nickel / gol
Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef
ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take
Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef
Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i
Electronics Forum | Wed Jun 11 11:33:07 EDT 2003 | tt
We have been looking around at all of the various BGA visual inspection systems, (i.e. ERSAscopes like contraptions). It seems like the number of different manufacturer's of these types of systems has exploded in the past couple of years, and it lo
Electronics Forum | Fri Jul 18 07:14:10 EDT 2003 | davef
BGA - Ball grid array QFP - Quad flat pack As a bonus, look here to learn more SMT terms and definitions http://www.smtnet.com/library/index.cfm?fuseaction=content_terms1 There are other listings of definitions and terms in the SMTnet Library. Lo
Electronics Forum | Thu Aug 21 15:50:12 EDT 2003 | davef
Couple of points are: * You're technically correct that ball height has the potential to vary by 8 thou, but we never see that much variation. Ball heights within a lot of components vary just about nil. * When we place BGA, we smush them into the p
Electronics Forum | Thu Aug 21 18:36:32 EDT 2003 | paulm
Hi Dave and Justin, Thanks for the advice. Dave you mentioned you "smush" your bga's. What type of machine are you placing then with it? Is the additional pressure to smush them machine or manually applied? Also, the 0.004" variance we are being
Electronics Forum | Tue Oct 28 12:41:42 EST 2003 | Stephen
I just reread your message. The wave soldering is on the other side? I.E. The Through hole parts are on the same side as the BGA. This would be the only way to do it. But reading the message again it could be interepted as the through hole parts
Electronics Forum | Wed Oct 29 17:30:17 EST 2003 | Gabriele
I am sorry, my understanding ( English is not my language)was to have BGA on SMT side, I mean destination solder of wave. But after your clarifiation, now I am in front to a DFX more that a Design for Manufacturing. In this case every think can be do
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Distributor / Consultant / Service Provider
3th, Tangchang 3rd Road, Hengli, Dongguan City
Dongguan, China
Phone: 008615629932323
.gif)
