Electronics Forum | Thu Sep 15 09:31:02 EDT 2016 | ladmo1
While removing one part, another part - BGA part - several components away, actually melted on one corner - you can see the plastic body of the part oozing out around one corner between the solder balls. Several of the solder balls on the one corner
Electronics Forum | Wed Oct 19 22:48:18 EDT 2016 | thaneshsivanadian
Hi All, Currently im seeing a cold solder/ poor wetting underneath the BGA Ball as i shown in the attachment. From the attachment you also can see one ball with poor wetting and another ball with a good wetting. When i checked with my re-flow profil
Electronics Forum | Wed Aug 22 03:07:20 EDT 2018 | robl
Doesn't look like it would be deliberately high temp for it's functionality or package type, unless it was accidental on a batch at the packaging plant. To get the datasheet you have to either go through the "request Info" on https://www.kingston.co
Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue
Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he
Electronics Forum | Thu Apr 25 05:17:08 EDT 2019 | pdrirrework
Hello All, Using IR will mean that there is no minimum distance to the adjacent components as there is not hot air flow. If components are heat sensitive around the BGA you can also tape them off with a reflective tape. The IR heat will bounce strai
Electronics Forum | Wed Oct 02 11:50:37 EDT 2019 | uzbek
Hi Shawn, we don't count on doing 0201 with that PnP. As for BGA and 0402 why would you hesitate with them? For 0402 I suppose that it could be a large number of rejects, am I right? But what is the reason for BGA? Also like I said we don't plan to
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Wed Jul 08 00:12:20 EDT 2020 | duchoang
Interesting!. They don't look like voids as usual meanings. The "voids" take the whole size of pads. We built millions of BGA, never seen those before. Look like the pads refused to connect with solder paste and pushed the paste away. Pads contaminat
Electronics Forum | Fri Aug 13 08:38:31 EDT 2021 | compit
> Any idea how to get the machine to see this part > and place it square??? I am really struggling. I > have tried it as a BGA but it never works The > part is on page 43-44 > https://connectivity-staging.s3.us-east-2.amazonaw &
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
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