Electronics Forum | Wed Feb 05 14:20:45 EST 2003 | Stephen
One thing that worked for me was simply rounding off the pads, making square pads into circlesfor the stencil. It worked but did seem a little strange turning squares into circles for 0603's and 0402's and turning cirlces for BGA's into squares, (bu
Electronics Forum | Sun Feb 09 23:41:37 EST 2003 | Dreamer
What are the key features that I need to know when evaluating an X-Ray Inspection Machine? Thanks for your feedback
Electronics Forum | Fri Mar 21 08:56:29 EST 2003 | russ
Is it possible that the flux you used, if applied in excess could have caused the balls to "blow out". I have seen this in the past and it was related to the type of flux we were using and the amount. Russ
Electronics Forum | Thu Feb 27 15:57:10 EST 2003 | Matt Kehoe
James, Could I get some contact info for you to call you about this? There is a solution for clean BGA's that needs to be discussed one on one versus here in the forum. mkehoe@sipad.net 770-475-4576
Electronics Forum | Thu Mar 13 19:11:03 EST 2003 | Wes
Does a third solder reflow compromise component and solder reliability? We find that the only way to rework a particular BGA without warpage is to reflow the entire board.
Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob
I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.
Electronics Forum | Wed Mar 26 15:53:47 EST 2003 | russ
If you are applying paste, you should duplicate the profile recommended by the paste manufacturer. If you are applying flux only than you need to ensure that you do not exceed max temp and/or ramp-rates such as
Electronics Forum | Wed Mar 26 16:05:13 EST 2003 | davef
Ren�: Look here to get started with you efforts: http://developer.intel.com/design/Quality/component/rework.htm
Electronics Forum | Tue Apr 01 18:42:18 EST 2003 | rdr
Well, here is what I have found so far. I have removed the top of the BGA and found that the ball had detached from the package. Three balls were removed with the two adjacent balls pulling the pads off the board and stayed attached to the BGA while
Electronics Forum | Wed Apr 09 22:26:23 EDT 2003 | MA/NY DDave
Hi, "Dave is there an easy way to calculate liquidous temp?" Just one comment for now. The supplier should know this temp or it's range. They do it with the bulk material. YiEng, MA/NY DDave
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