Electronics Forum | Wed Jun 18 03:19:34 EDT 2014 | edriansyah
Hi All. I'd like to do a little benchmark with you all regarding regarding the reflow speed. What is your highest reflow speed? My own experience is 8.0 m/minutes using a 10 zone reflow machine. Conditions: Mix boards (not only chip components, bu
Electronics Forum | Mon Jul 14 11:59:41 EDT 2014 | rgduval
I've primarily used MyData equipment, personally, and, optically centered devices definitely take longer than mechanically centered parts on a MyData, owing to the construction of the machine. With a fixed upward looking camera, the head has to pick
Electronics Forum | Thu Jul 17 20:20:21 EDT 2014 | mac5
Hi June, The biggest issue with an OSP finish is as soon as the PCB sees a heat cycle (reflow or wave) the finish will begin to degrade. If you have a single sided SMT assembly with THT components installed downstream it works pretty good. But a dou
Electronics Forum | Thu Nov 20 17:46:48 EST 2014 | warwolf
If they asked you should try it? Im really interested in the outcome in general. We use no clean on 6 layer multi micro-BGA boards, chip size only goes as small as 0603 though. Around ~500 parts over a 4"x3" area. we haven't noticed any independe
Electronics Forum | Tue Mar 24 22:03:39 EDT 2015 | davef
Here's some notes from IPC APEX 2015: * Black underfill is Heraeus. It needs to be preheated to 180-200*C for rework. Above 200*C it changes state and becomes difficult. * Clear underfill is from an unknown Korean supplier. * People from Heraeus w
Electronics Forum | Wed Mar 25 03:27:13 EDT 2015 | slave2anubis
Hi davef, thank you for sharing this. Yes all manufacturers recommend their products, and i dont deny that they are good but for a small shop like i have i think the prices are a bit high. What i think would be a good technique, is heating the area t
Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira
Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our
Electronics Forum | Thu Nov 26 12:08:19 EST 2015 | jvalverde
My company sells the end product but It want to offer assembly services. We do not know how we can calculate the costs that would have to charge and use parameters need for the quote. According to some websites manufacturing services using the Board
Electronics Forum | Wed Feb 10 10:12:35 EST 2016 | vaghelarajeshh
Thanks Mr. Davef, I had tried all possible factors to see good results. BUt I coudln't. 1. Baked Board 2. Board size is small. I used supporting pins so there is less chanches of bowing. 3. I tried to change the profile many times but result is n
Electronics Forum | Fri Jun 10 12:51:54 EDT 2016 | ttheis
Our company is looking to upgrade from a dek249 semi-auto printer to an automatic inline printer since we're doing some fine pitch packages which are tricky to line up, and we'll soon be tackling bga's for our products. We're looking on the used mark
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
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