Electronics Forum | Tue Apr 13 13:45:26 EDT 2004 | arcandspark
Ken you say reaching 218 to 221 C will give a homogenus solder ball. The pb free solder balls on the BGA reflow at 235 C to 238 C but I have seen when you combin to differnt types of solder say 63-37 and 10-90 you will atually lower the melting point
Electronics Forum | Tue Apr 13 20:57:14 EDT 2004 | Mike Konrad
Hey Dreamy, Dave is correct. If you attempt to clean your water soluble (OA) flux with water only, you will turn the no-clean flux white. No inspector or end-user will accept this. If a proper cleaning system is not available to you, then I would
Electronics Forum | Mon May 17 02:06:57 EDT 2004 | johnwnz
Look here: _a class=roll > href="http://www.aimsolder.com/techarticles/tech%2 > 0sheet%20BGA%20voiding-%20reducing%20through%20pro > cess%20optimization.pdf" > target="_blank"_http://www.aimsolder.com/techartic > les/tech%20sheet%20BGA%20voidin
Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
Electronics Forum | Tue Jun 15 15:57:00 EDT 2004 | russ
I have used one in the past and wish I had one now. Is that enough input? We had great success with this machine. The large lower preheat and board supports worked very well for large thin boards. We never experienced any problems with this machi
Electronics Forum | Fri Aug 13 19:49:38 EDT 2004 | Paul
Funny how these things are. I see more PACE equipment on the shelf and on EBAY. I've seen hundreds of the Zephyrtronics units in Raytheon myself...all being used and on very, very large boards. I believe that they actually have a far larger selection
Electronics Forum | Tue Aug 10 09:09:39 EDT 2004 | mattkehoe
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
Electronics Forum | Wed Feb 09 21:41:49 EST 2005 | Grant
Hi, We have been running the same stencils for about a year, 5 thou thick, 1-mm pitch BGA's and every-things been ok, but then suddenly over the last week, 2 different products have had paste release issues with the BGA. It's odd because nothings c
Electronics Forum | Thu Jun 02 18:16:26 EDT 2005 | URI
Look into the Juki KE-2060E machine. I have been > extremely pleased with this machine. It will > hold 80-8mm feeders, place 0201 (0603-metric) up > to 74mm square ICs and BGA, 150mm long > connectors. Up to 25mm tall components. It can > ha
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