Electronics Forum | Tue Mar 14 21:09:20 EST 2000 | Dave F
Emmanuel: Take Jax's word. NiAu (ENIG) primary (some would say only) redeeming characteristic is its flatness that you mentioned, but that flatness appeals to folk placing fine pitch devices, rather than BGA. Good luck. Dave F
Electronics Forum | Wed Feb 16 09:33:09 EST 2000 | Kurt Waskow
Interested in information regarding PCB soldermask tenting over vias within a BGA layout. Is this a common practice to reduce the occurrence of shorts, are there any reliability concerns? Thanks!
Electronics Forum | Mon Feb 21 08:33:53 EST 2000 | Tony Di Mauro
Kurt, When I was working in a captive manufacturing house we had been to migrate toward tenting all vias under the BGA to eliminate not only shorts but insufficient (Starved) joints. Tony
Electronics Forum | Mon Jan 22 21:30:41 EST 2001 | dason_c
I had my experience when I run the Motorola BGA and I am not sure the voiding was created due to the incompatible flux residue. Rgds. Dason.
Electronics Forum | Wed Feb 14 21:14:45 EST 2001 | davef
BGA Shorting 1 Damaged mask in between the BGA pad and via on the substrate. 2 Poor print registration. 3 Poor via segregation from the pads? Are they tented or is there just a dam in between? 4 Review the profile. You can run into a number of p
Electronics Forum | Tue Feb 20 16:56:36 EST 2001 | davef
There has been substantial amount of FEA done on predicting BGA ball reliability, but this has most often been applied to assessing the reliability of the design of products, rather than the effects of rework. This sounds like an interesting proje
Electronics Forum | Thu Apr 19 08:47:31 EDT 2001 | Cal
If Fosters is Australian beer is......Amkor's Super 560 SBGA Austrailian for uBGA? I agree with Dave F. Practical Components is your best best. They have provided us with components and PCBs for years. G'day, Cal
Electronics Forum | Mon Apr 30 09:20:50 EDT 2001 | Steve Zanola
We have seen the same thing. Our vendor recently change the way the BGA is fabricated and the new package warps. We are currently trying to adjust our process paramentes to fix this problem. I will try the "bake out" suggestion and see if it cor
Electronics Forum | Thu May 17 07:58:25 EDT 2001 | Bob Willis
I think the answers to the problem have been given but if anyone wants to see this happening and solder shorts forming during corner warp there is a video clips on BGA shorts to download. Its available free on http://www.bobwillis.co.uk It should am
Electronics Forum | Wed Apr 25 13:28:12 EDT 2001 | davef
You can make bare BGA balls short together, depending on how you choose to heat the device. Lookit .. [http://davesmt.50megs.com/pictures/ select bgashortng.avi]
.gif)
