Electronics Forum: bga and crack (Page 1 of 50)

BGA crack and strain gauge measurement

Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef

There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear

BGA crack and strain gauge measurement

Electronics Forum | Wed Nov 29 01:12:12 EST 2006 | callckq

Dear Davef, Thanks for your input...The crack happen at the pad/solder ball interface..Pls review the new thread that I post just now with title called "BGA BALL CRACK AT PAD/SOLDER BALL INTERFACE" Thanks!

BGA crack and strain gauge measurement

Electronics Forum | Sat Nov 25 21:26:55 EST 2006 | callckq

Dear all, I have an issue here where we found BGA crack. Understand from friend, we need to study any possiblity of our own jig or fixture cause this problem via strain gauge measurement..My question: Is there any standard @ specification establish

BGA Straight crack

Electronics Forum | Tue Feb 26 07:54:27 EST 2002 | vincent_f

3um 0.03um

BGA inner hairline crack

Electronics Forum | Wed Sep 09 11:17:09 EDT 2009 | clampron

Hello Radek, Does a new (unbaked) BGA exhibit the same crack? If so, adress this with the manufacturer. If not, what are your baking parameters? Chris

BGA Straight crack

Electronics Forum | Thu Feb 21 16:28:44 EST 2002 | Dave G

Sounds like the Infamous "Black Pad" Phenomenon to me. A search through the Archives should bring up lots of stuff. DG

BGA inner hairline crack

Electronics Forum | Fri Sep 04 02:27:48 EDT 2009 | hurr

Hallo all, when I remove one from us malfunction BGAs from PCB I saw under X-ray inspection inner hairline crack.(see fig.1.) BGA was dried according to J-STD 033 and reflowed in lead process. When I look at new (baked BGA) under X-Ray inspection I

BGA Straight crack

Electronics Forum | Thu Feb 21 13:08:06 EST 2002 | vincent_f

Hello, I had recently a problem of crack between the solder ball (SnPb) and the Ni layer of the PCB pad. We use Electroless Ni/Au technology for PCB. This phenomena is amazing because the crack is very clean (straight) and it creates a space betwee

BGA Straight crack

Electronics Forum | Fri Feb 22 08:26:51 EST 2002 | davef

You are correct. The gold dissolves in the solder. The gold is meant to protect the nickel from oxidizing, so that you can solder to the nickel. Obviously that didn�t work as planned. Your background information is very sparse. Two things come

BGA Straight crack

Electronics Forum | Tue Feb 26 10:55:58 EST 2002 | davef

This could be an electroless nickel / immersion gold specification. While the symmetry of the numbers is pleasing to the eye, but as Joyce Marchand says, "It doesn't blow-up my skirts." Problems with your specification are: * Lower end of the gold

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