Electronics Forum: black pad (Page 26 of 32)

BGA Reliability

Electronics Forum | Wed Jul 24 23:21:26 EDT 2002 | ppcbs

Being in the line of BGA rework and having performed much rework on boards that go into military planes, I can give you an opinion from a practical background rather than an in depth study. Basically BGA's have caused many of my customers big headac

Re: Black spot on Gold Pads

Electronics Forum | Tue Nov 28 21:07:44 EST 2000 | Alvin K

Gold is porous and spots on gold plated PCBs is one of the drawbacks of using gold as a solderability protector. Base Nickel exposure seems to be the cause of this and is aggravated when the gold thickness is less than what it should be. I agree with

UIC GSM and NiPdAu pads

Electronics Forum | Mon Oct 19 15:43:37 EDT 2009 | dilogic

We have a problem with QFN IC's with NiPdAu plated pads. Our ULC's don't see the pads due to the almost ideal reflection. Vision sees the pads almost black. As we don't have OAL-cameras (which can help in this case, I assume), I am thinking of back-l

Black spot on Gold Pads

Electronics Forum | Sat Nov 25 18:45:19 EST 2000 | Ashok Dhawan

I am getting black spots / stuff while I run gold finish PCB through reflow soldering process using NC solder paste.The affected spots have intermetalic as black in color. Does not solder very well. I did look at the archieve but could not find info

enig

Electronics Forum | Tue Jan 04 12:37:41 EST 2005 | Cmiller

We have been using this finish almost exclusively for fine pitch boards for about 5 years. Make SURE you use a board house that does the gold plating in-house. There are some potential issues as DaveF stated. The only problem we have encountered is w

Thermally Conductive Epoxy

Electronics Forum | Fri Aug 03 22:36:28 EDT 2001 | mugen

We used Thermal Pads, made of black rubbery material, and sticky on both sides (like x2 side tape), intent is to place in between, BGA/QFP and the PCB board, and reduce the air-gap flow between, the PCB to SMD... air-gap will permit air flow, that i

Re: Dark Pad / Gold Embrittlement?

Electronics Forum | Thu Jul 27 21:57:16 EDT 2000 | Dave F

Hi Doug: Responding to your questions: � If gold over nickel is self limiting ... You didn�t say whether you gold plating was electroless or immersion. Electroless is not is self limiting. It can plate up to 5 thou. Expect immersion plated gold to

Poor reflow over gold plating

Electronics Forum | Wed Jun 29 06:57:20 EDT 2005 | mattkehoe

Hi Bob, We tried flowing the pads with a soldering iron. The pad at the tip of the iron went shiny but as soon as the iron was taken away, the pad returned to the dull finish. You could actually move the tip around the pad and it would shine up then

BGA open joint

Electronics Forum | Thu Aug 05 21:47:35 EDT 2004 | KEN

Agreed. Joint failure can happen when un-bagging or durig box-build (at customer site). Careful handling should be used. In one case I had boards returned to me for evaluation and failure analysis. Too bad our site never built the boards!!! (jacka

ENIG again! Failed BGA joint!

Electronics Forum | Tue May 08 15:05:08 EDT 2001 | davef

It�s reasonable to want to understand this strange looking fabrication, before moving on to other issues. Before moving on to that, tell us more about your thinking the silicon being from the BGA package. What kind of plastic package is this? Desc


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