Electronics Forum: blades (Page 46 of 54)

Researching stencil cleaners

Electronics Forum | Tue Mar 27 18:58:36 EST 2001 | Mike Konrad

Hi Kerry, You are putting too much emphasis on the EPA�s �ENVIRONMENTAL TECHNOLOGY VERIFICATION STATEMENT� Consider the following EPA statement taken from the specific EPA report that you site: �� the end-user should contact his/her local, state,

Scored Printed Circuit Boards

Electronics Forum | Wed Aug 01 11:03:20 EDT 2001 | Chip Gill

I read your request for design information on panel layout for V-scoring, and felt the need to respond. Scored PWB's are indeed more efficient to produce and depanel than tab routed PWB's, but there are also drawbacks associated with this method. T

Re: Breaking scored boards, breaking components.

Electronics Forum | Tue Nov 16 10:53:25 EST 1999 | Scott Cook

Ok, help me out here guys and gals...... I have never understood the concept of scoring on mixed technology or SMT boards. It is quite obvious to me that the potential for SMT solder joint damage through the mechanical stresses of breakout are high.

paste release from stencil, and volume calculation

Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas

We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having

Re: paste release from stencil, and volume calculation

Electronics Forum | Sat Nov 13 14:09:45 EST 1999 | se

First, let me say what I always say: a good chem-etched stencil will print fine pitch. Chem-etch brings trap to the side walls because its a physical by-product of the process. Because they are less expensive you can add electropolish and still save

Re: Solder Paste and Stencil questions

Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se

| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using

Re: screen printer x axis

Electronics Forum | Fri Sep 17 15:43:08 EDT 1999 | Dave F

| HI everyone, | | We are using a Siemens ap-25 screen printer, in the past we have not had any problems with adhesive placement until a couple of weeks ago. It seems the x axis has decided that it should be set somewhere between .00085 and .001

Re: screen printer x axis

Electronics Forum | Fri Sep 17 21:25:00 EDT 1999 | Rob

| | HI everyone, | | | | We are using a Siemens ap-25 screen printer, in the past we have not had any problems with adhesive placement until a couple of weeks ago. It seems the x axis has decided that it should be set somewhere between .00085 an

Re: Step-down stencil Versus Reduced Aperture Design

Electronics Forum | Thu Sep 02 07:22:03 EDT 1999 | Earl Moon

| I'd like to know the advantages and disadvantages between the two. | | Thanks and regards, | | Both have their place. When using less fine pitch (.025" +) with fine pitch (.020" or less and BGA's) a .007" thick stencil may be used. This would re

Re: screening adhesives

Electronics Forum | Sat Aug 28 14:23:52 EDT 1999 | JohnW

| Hi There, | | Could anyone please give me some pointers on screen printing non-conductive adhesives or where I could find the information avaliable. Aspects such as printing parameters, ideal stencil design and a general overview. Do already have


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