Electronics Forum | Tue Nov 25 10:00:27 EST 2008 | wavemasterlarry
I use a alcohol rag and compressed air to blow out them via holes. I think washing is over rated. A simple wipe is all you need. Plus it keeps the planet green which is what everyone seems to be squacking about these days. Thats why I wash one a
Electronics Forum | Fri Mar 02 08:52:20 EST 2001 | markkrmp
Are your voids looking like blow holes also? Is this only occurring on the solder joints of the Thru Hole components and Via's? Or does this happen on SMD pads? My experience is that we have seen this but only with some of our older PCB's which are
Electronics Forum | Thu Oct 31 11:08:12 EST 2002 | soupatech
Being very new to SMT I won't assume I know what the problem is but.... I had lots of air pockets in solder joints, 95% of the boards. Everyone I spoke to thought it was a problem with my process but when one board was sent to our supplier they admi
Electronics Forum | Tue Mar 24 11:20:18 EST 1998 | Earl Moon
| Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via? Typically, micro vias are drilled and plated to about .003" diameter. To avoid significant solder "drain off," they should be drilled as shallow
Electronics Forum | Wed Apr 21 14:29:58 EDT 1999 | joe devaney
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Wed Mar 25 16:38:21 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no issue with .030" solder balls, since the actual volume of the .002" via in pad is small compared to the ball+solder paste volume. We did notice random bubbles where, apparently, the sol
Electronics Forum | Wed Mar 25 16:36:10 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no drain off with .030" solder balls, since the actual volume in the .002" depression is low. We did notice random bubbles where, apparently, the solder reflowed and trapped the air in the
Electronics Forum | Wed Mar 25 19:41:01 EST 1998 | Earl Moon
| We have successfully put .016" vias in .030" pads. | There is no drain off with .030" solder balls, since | the actual volume in the .002" depression is low. | We did notice random bubbles where, apparently, the | solder reflowed and trapped the a
Electronics Forum | Tue Jan 21 13:51:19 EST 2014 | rgduval
Armando, Is the problem in the same spot on the board with every run? If so, there might be something about that particular location that is part of the cause (ie. ground or power plane connection). It sounds like you're seeing blow holes, or insu
Electronics Forum | Thu May 28 09:23:59 EDT 1998 | Chrys
| Hello, | | I need some users information about "hot air knife" after the wave | bath: | - Defects reduction ? | - In what kind of boards(TH/SMT SOICS ect.) it is applied ? | - Where can I purchase it as a retrofit (Soltec Delta 6622cc) ? |
