Electronics Forum: board (Page 121 of 1642)

Dip Soldering Advice

Electronics Forum | Wed Nov 16 09:22:24 EST 2005 | chunks

These are all good questions. Dip fluxing is fine. Make sure you let all the remaining flux drip off the board. Letting it drip into the pot will cause a lot of spattering of hot solder � be careful. Dipping the board slowly into the pot should

Wave Solder - solder bubbles/outgassing??

Electronics Forum | Tue Nov 14 18:38:59 EST 2006 | Brandon

Hello all, I am having an issue with some boards on our Wave Solder. It is a Pb free wave and These particular boards are exibiting A LOT of what I call solder bubbles in the larger than usual vias and un-used thru holes. Settings: 4 inch/min 144c to

Comformal Coating Stripper

Electronics Forum | Thu Feb 28 21:01:09 EST 2008 | davef

Tony: Thanks posting information about your experience with strippers. First, why did you need to strip the entire board? Next, please clarify the following points to expand our knowledge of using Humiseal 1063 Stripper: * How long was the conforma

FR4 boards Delamination Cause?

Electronics Forum | Wed May 07 17:52:36 EDT 2008 | wayne123

I have these boards that are a four layer FR4 material, we had been running them for quite awhile with no trouble, and then they started delaminating, I checked my Reflow oven profile and I was barely hitting the temps required for our paste, we then

Quad 2C ICOS Error

Electronics Forum | Fri Nov 18 12:32:56 EST 2011 | gosswald

I have a Quad 2C I have been in the process of setting up. Currently everything seems to be working on the unit but I am having some vision inspection problems with it. The vision system does comes on line and seems to work correctly. I have one bo

warpage for 152mm length PCB

Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef

Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies

MPM UP2000

Electronics Forum | Wed Sep 30 06:22:23 EDT 2015 | mervin

MPMENG, Thank you so much for taking the time to help. The machine has Y snuggers and flippers. The Pcb is loading in the center all the time. The driver cards look fine there is no obvious faults on them or partially burned. The machine was not in

Re: BGA repair/rework

Electronics Forum | Mon Mar 08 20:17:41 EST 1999 | Michael Larsen

| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using

Re: baked on water soluble flux residue betwwen fine pitch comp.

Electronics Forum | Fri Dec 01 16:02:33 EST 2000 | Jim M

Thanks for your reply. I 've tried to clarify and answer your questions. The water soluble paste used is WS3060, type 4. The boards are sent through a inline di cleaner after reflow. There is a hot Di waterwash, rinse and then hot air to dry the wa

Re: Printed Circuit Board Material

Electronics Forum | Tue Oct 17 12:15:19 EDT 2000 | NLykus

Dave, Current process is Insert through hole components topside Dispense SMT glue Place SMT components bottom side Glue cure Insert 1 through hole component by hand Wave Wave temperature is 480oF Topside preheats in D.O.E ranged from 99oc to 108oC


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