Electronics Forum | Thu Mar 30 04:42:28 EST 2000 | cpgoh
HI all, thanks for the advise.. Electrovert is being used from 7am to 7pm and we do dedross from the surface of the solder bath during lunch time around 12nn. Break Time we just sweep them to the side.. Every two week, we do the solder bath maintena
Electronics Forum | Thu Mar 23 20:31:45 EST 2000 | davef
Hey Cartman: Recently, I was over at a plant that does ICT on RMA fluxed boards and asked them about flux residue on test probes. The test machine operators: * Think flux residues are a pain in the gluteus maximus. * Change probes (from a collectio
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
Electronics Forum | Mon Feb 28 20:17:02 EST 2000 | Eldon Sanders
I need to side mount a standard HC-49/U crystal on a board using double sided foam tape. I am looking for a source for pre-cut foam tape. In prototype runs I have used 3M #4950 foam tape cut to size one at a time. But for production I want it pre-
Electronics Forum | Mon Feb 28 19:36:39 EST 2000 | Tony
I work for a contract manufacture of PCB's, we are also in the BGA rework business. We see all kinds of different size boards, as well as different types of BGA's and micro BGA's. We selected the Conceptronics Freedom 2000 over the Air Vac and SRT. T
Electronics Forum | Fri Feb 25 14:34:44 EST 2000 | Ioan
Larry, the best paste thinner is the one that your paste supplier recommends. You should check with him. We have no problems removing the no-clean paste with alcohol. If you want to give it a try, make sure you use IP alcohol, not alcohol based flux
Electronics Forum | Wed Feb 23 21:24:42 EST 2000 | Dave F
Chris: Whatever way you decide to define your pads, use the same type on the component and the board. Non-solder mask defined pad advantages: � No point-of-stress concentration at edge mask and solder ball � No CTE mismatch at edge mask and solder
Electronics Forum | Tue Feb 22 07:59:54 EST 2000 | Hany A. Salam
Hello friends: In a few weeks we will have to assemble PC motherboards. We decided to use to purchase an ICT for testing the semi assembled boards (I mean with only SMD components on). Would anyone kindly like to recommend a SPECIFIC brand or model
Electronics Forum | Thu Feb 17 11:38:53 EST 2000 | Steve Thomas
We appear to have solved a major reflow process problem (poor quality joints on a 20 mil QFP100...excessive solder left on the lead leg, not much left for a joint) with a design change to the board. We gave ourselves considerably more room for a hee
Electronics Forum | Wed Feb 16 15:29:15 EST 2000 | John S.
My company manufactures electronic modules for the automotive industry. We have a current product that the customer would like a "heavy duty" version of. The module will have to handle roughly twice as much power as the original. A couple of compo
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