Electronics Forum: board (Page 1426 of 1642)

Agilent SJ Series AOI

Electronics Forum | Tue Oct 18 06:55:48 EDT 2005 | jaks

I have written software that will log inspection results from the Agilent SJ series AOI machines. It is a standalone package including graphical repair station software. There are 3 output formats. Two text formats and a direct access database write.

Etchback

Electronics Forum | Wed Oct 19 07:44:33 EDT 2005 | davef

When a hole is drilled during board fabrication, it can transfer resin from the base material (eg, FR4 core or prepreg) to cover the exposed edge of conductive material in the wall of a drilled hole. This is called resin smear. Etchback is a control

V-score cracking components

Electronics Forum | Tue Nov 15 08:41:04 EST 2005 | Joe Wesley

Since I asked the question - here is what we have identified. We are doing what we call a jump score. Routing critical areas with v-score in non-critical areas. We have optimized the v-score depth as much as we can without having separation through h

RoHS parts - leaded solder

Electronics Forum | Wed Oct 26 10:40:43 EDT 2005 | patrickbruneel

Jimmy, We've been soldering tin plated components and Ni/Sn (100% Tin) boards with leaded solder in the 80's in hirel and military applications. We never experienced reliability issues with the mechanical or electrical properties of the solder joint

Screen Printing Print Validation

Electronics Forum | Tue Nov 01 19:53:23 EST 2005 | KEN

Um...for you mylar guys....esd safe? Why worry about the first two prints. Worry if they power up or not when sent to funcitonal test. Zapp! I think I know where this is comming from. It is not that uncommon to have a sacrificial print. However,

Gel Flex Support

Electronics Forum | Fri Nov 04 13:00:24 EST 2005 | pjc

Some clarification: Max bottom side component is not 5mm as someone posted, its 12.7mm (0.5"). This is if you're going to have a Gel-Flex block under that component. Any component height at or over 12.7mm must not have a Gel-Flex block under it. Al

Batch Ovens

Electronics Forum | Fri Nov 04 02:23:58 EST 2005 | grantp

Hi, Yes, you will save a lot of money in the end. From what I have experienced you cannot heat up a oven full of air, and cool it down fast enough to match a suitable reflow profile. So passing the board through the zones using an inline oven is th

Batch Ovens

Electronics Forum | Sat Nov 05 07:17:25 EST 2005 | JeffP

That was the case with your oven but it is not so with ours. First, the distance from walls of the inner chamber to the product differs from one oven to another. Second, the dissipation of heat from metal heats up the air in the oven which in turn h

Help!!

Electronics Forum | Tue Nov 08 20:50:03 EST 2005 | davef

First, general comments about voiding in wave soldered connections are: * Causes of voids in solder connection are many: moisture, flux/paste volatiles, wave process, etc. * Impact on reliability of voids in a PTH solder connection is insignificant,

Lead free component VS vision on Mydata M12

Electronics Forum | Tue Nov 22 10:46:46 EST 2005 | A Total Green Planet Solution

Try using a contrast filter. This seems to help. Also on the camera it self there is a white level control. Adjusting this may help. The bad thing is it may affect all your other profiles. Some times an easy fix is to have a screen print mark close t


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