Electronics Forum: board (Page 1486 of 1638)

Philips pick n place angle

Electronics Forum | Fri Jan 18 20:50:21 EST 2013 | sarason

The math is a function of how the component is orientated on the reel/tape. Verse how it is oriented on the board. Different SMT machines use CCW or CW orientation. Different CAD packages use CCW or CW. The next question is which Cad package are you

Large Radius Curved LED Lighting Designs (Multiple feet)

Electronics Forum | Wed Dec 06 05:50:42 EST 2023 | calebcsmt

For typical small sized circle LED panels, you can simply have a PCB routed to said circle... but when lighting fixtures are sizes 2-3 feet+, and a circular, typically how are the LEDs being spread across the radius? I can see flex LED strips being

applying ink to Panel of PCB's

Electronics Forum | Mon Jan 15 20:03:09 EST 2024 | griinder

Does anyone have experience of using a stainless Fine Grain SMT stencil for the purposes of applying ink to bare PCB's? We are exploring the possibility of getting a stencil to apply a letter that reflects the revision to each of 25 PCB's in a panel.

Reflow soldering of lead-free components with leaded solder paste

Electronics Forum | Fri Feb 23 10:10:32 EST 2024 | emanuel

Well, the story is a little more complicated. The product is also an LED lamp made on an aluminum PCB with the LEDs on one side and the drivers on the other. The board itself is not big, about 90x90mm and most of the components are soldering well. Us

Help finding a high capacity pick and place machine

Electronics Forum | Tue Mar 19 11:54:56 EDT 2024 | tommy_magyar

Hi there, I've been happy with the iiNeo and iiNeo+ from Europlacer, both have the capacity of 8*33 8mm feeders (264 slots in total). It can build boards up to 505*360 mm (our biggest PCBA, maybe it can do bigger one too). 6 and 12 monthly services

Re: baked on water soluble flux residue betwwen fine pitch comp.

Electronics Forum | Fri Dec 01 17:03:57 EST 2000 | Dave F

Curious, very curious ... Residues � Where are these residues? [solder & laminate / mask, solder only, laminate / mask only] What is the result of your analysis to the residues? How do you know it�s a flux residue, rather than a chemical by product

Re: BGA problem: open after reflow

Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F

Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol

Re: N2 reflow

Electronics Forum | Mon Oct 16 20:33:18 EDT 2000 | Dave F

MK: If you are getting good product with air, here�s what you should do: * Turn off the N2. * Sell that N2 cracker machine. * Pat yourself on the back. * Go out for beers. [Not any of that Canadian Fosters crap, tho][Did you know that Ozzies do

Re: Cost of solder joint rework

Electronics Forum | Tue Jun 06 14:05:22 EDT 2000 | Jeff Sanchez

Ray, I don't know for sure what exact data Ceeris used to come up with their figures. Did they account for shipping? Was the rework done by expensive equipment? When I read your thre

Grainy SMT Solder Joint

Electronics Forum | Tue Apr 10 13:12:41 EDT 2001 | davef

You've told us nothing about your situation, process, boards, or anything!!! If you leave some boards with very fine solder connections on the shelf for a cuppla years, the grain will become coarse. What do you mean when you say "grainy"? What is


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