Electronics Forum | Mon Aug 27 15:03:40 EDT 2001 | davef
Essentially, you want to ruggedize this component. Various adhesives could work great, depending on the source of the energy that is causing the solder connection fatigue. So, what are your looking to: * Rigidly bond the component to the board? * A
Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky
I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for
Electronics Forum | Wed Oct 10 21:35:39 EDT 2001 | cnoonan
I used to rework many types of BGA's including ceramic. We always preheated the whole board to around 115 c before attempting to remove or place. Now I find myself in a new company with different ideas. Do any of you have a site that has exact recomm
Electronics Forum | Tue Oct 30 18:43:31 EST 2001 | mparker
My first thought is board warp. This is something you can't see when the board is in a reflow oven. I see it occasionally going through wave solder. You may need a pallet with hold down clamps for reflow. Try putting a bare board in a baking oven at
Electronics Forum | Mon Jan 28 07:40:40 EST 2002 | cnotebaert
Yes and Yes, Your solder supplier should recomend a profile (standard profile) in most cases you can follow it. Of course you should be running a thermal profile of each board type to verify it is within the specified temp rang. You should also chec
Electronics Forum | Tue Apr 23 14:39:49 EDT 2002 | mkallen
Here's a related question: How hot can a PBGA get before popcorn delamination becomes a concern? 100 C? 150C? I realize that the answer will depend upon the conditioning of the part, so let's assume that the part is saturated with moisture. A pra
Electronics Forum | Mon Jul 07 00:33:12 EDT 2003 | praveen
First we have to look in to the current situiation of the SMT line.Is the pick and place machine very old and can not perform consistently. Is the board to be inspected is very dense and have lots of connectors and fine pitch comp.with lots of 0402 c
Electronics Forum | Fri Apr 12 16:30:21 EDT 2002 | stepheno
If you are going to wavesolder the board after SMT you will have to epoxy the parts on instead of paste/reflow. I used to work for a company that squeeged it on. You will have to research component layout guidelines if you do want to wavesolder. If
Electronics Forum | Mon Apr 15 22:37:27 EDT 2002 | davef
Regarding your customer suditor, it would have been nice if you said something like ... Routinely, our testing shall be less than 1.56 microgram/cm^2 NaCl equivalent ionic or ionizable flux residue, according to TM-650, Method 2.3.35 'Detection And
Electronics Forum | Thu May 09 10:00:19 EDT 2002 | brianockert
I'd tend to agree with what the others have said. Check the basics, board supports, setup, wiper paper working correctly. If it's a humidity issue, try taking some paste, place it on a chem wipe, and roll it around a bit, which removes some of the mo
