Electronics Forum: board (Page 786 of 1642)

Re: Surface Mount Solder Balling

Electronics Forum | Fri May 29 16:07:55 EDT 1998 | Steve Gregory

| | Thanks Steve- | Here is the whole story: | | The solder balls are appearing all over, similar to a | splatter. They are relatively small. We are using H-Technologies | S-HQ no-clean solder paste. The stencil is 6 mil and the boards | are ru

Soldering

Electronics Forum | Wed Dec 05 17:30:02 EST 2001 | davef

How do you know that "approx 450�C" is "too high"? As a side, the temperature on the temperature sensor is: * Inaccurate. * Not the temperature at the solder. Listen, operators are smart people. They have figured-out that they can solder faster wi

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.

We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he

COB Process (Chip On Board)

Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI

Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject

reflow profile development

Electronics Forum | Tue Sep 09 12:05:44 EDT 2008 | tonyamenson

First and fore most is to find your paste manufacturer spec sheets. Read it over several times and let it all sink in. Then call them with questions as they want to keep your business so their engineers want to help you use their product. I assume y

Lead-Free alloy determination in repair / rework

Electronics Forum | Tue Mar 08 11:50:55 EST 2011 | pgoodyear

As a technician that does frequent board level repair / rework some issues have come to mind. I have been an electronics technician for almost 50 years. In that time I have seen the evolution of electronics from point to point wiring using vacuum

Black color solder wetting after reflow

Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs

Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t

First time Pick and Place Machine

Electronics Forum | Mon Jul 17 15:35:09 EDT 2017 | svfeingold

Evtimov, I thank you for your response. I posted a thread about this on EEVBlog but there is less experience there for this type of equipment it would seem. If your interested there's a lot more detail about what I'm after: http://www.eevblog.com/for

Re: Simutaneous Double sided reflow assy

Electronics Forum | Thu Jul 20 17:01:26 EDT 2000 | Bob Willis

Here is some further information on SDSRS process, but please purchase a copy of the report from t he SMTA as all the money goes to charity. In the UK the SMART Group raised over �3000 for the homeless. SMTA have been raising a lot of money for the G

Re: SDRSS

Electronics Forum | Thu Jul 20 15:08:53 EDT 2000 | Bob Willis

Yes no problem here it is in a nut shell. The sponsor of my CD ROM on this process was Loctite who specifically developed a glue for the process to cure in less than 10seconds. Have a word with these guys they may even have a few CDs. PROCESS SEQUEN


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