Electronics Forum: board (Page 1221 of 1642)

problem in solderability

Electronics Forum | Wed Sep 10 19:36:54 EDT 2008 | vladig

Why just a half, I'd be glad to send a whole one. Just let me knwo what you want and the phone number of the one you want to get it from. :-) The discussion was well worth it :-) On your China board "experience" I completely agree with you. It is al

looking for HASL TIN thickness specification

Electronics Forum | Wed Sep 03 19:54:23 EDT 2008 | vladig

Well, I'm not a sale person whatsoever. I'm a purely technical guy (even PhD :-)) who has been with the industry for quite a few years and I know very well what intermetallics means and how thck it should be for different board finishes and solders

Underfill 300balls BGA connector

Electronics Forum | Sun Sep 07 09:57:23 EDT 2008 | davef

We have BGA connectors on rigid laminate. Points are: * We love BGA connectors for mating mother/daughter boards because they eliminate the wave solder step required for PTH connectors. * BGA connectors are very tricky to assemble, much trickier than

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Wed Sep 10 11:34:05 EDT 2008 | patrickbruneel

Amen to that!!! When I was still on the production floor and had problems I couldn't go to the production manager and tell him/her we had to shut down the production line and have the boards send in for analyses. (He/She would have seriously questio

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Wed Sep 10 14:56:57 EDT 2008 | rarnold

I am dealing with a similar uncoalesced solder issue. This defect has come and gone several times during the last 6 months. See image. In my case, I am using conventional SnPb solder and an entire strip of my OSP finished board (includes various de

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Thu Sep 11 11:12:52 EDT 2008 | aj

Hi, I had similar problem a while back. Diagnosis was a combination of two things: 1 - Gold thickness was below spec. which gave us solderability problems. There should be other areas of the board that show signs of this. 2 - The devise in queast

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Thu Sep 11 14:47:40 EDT 2008 | rarnold

For Production purposes, the problem goes away when a new solder paste lot is used. As I reported in my first message though, the problem keeps coming back. Most likely, paste lot is not the Root Cause (3 different lots now in the last 6mo). I rea

Clean vs No-Clean

Electronics Forum | Tue Sep 09 09:04:17 EDT 2008 | davef

Oh that's GREAT. Now, we're encouraging engineers blow to saliva on boards. The saliva is made 99.5 percent of water and 0.5 percent of dissolved inorganic compounds. One third of the 0.5 percent are dissolved metal-ions such as Ca2+, Na+, K+, Cl- a

OEE measurement

Electronics Forum | Sun Sep 14 06:37:11 EDT 2008 | johnjohn

Hi All, I am trying to work out the OEE of my NXT equipment to IPC. I am presently trying to work out what metrics I need can anyone help me with this. I think I need the following Machine rating IPC 70% of machine rating, cycle time, What I am tr

DC Offset from IC when PCB is flexed

Electronics Forum | Fri Sep 26 12:16:28 EDT 2008 | jsmale

Has anyone seen this? - We have a new smt pcb with 2 x LF356 (Op-amp) IC's on it (plus others). When the pcb is flexed the O/P of each IC changes by �2mV DC. i.e. the board is acting like a strain gauge! There is no oscilation and when I replace th


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