Electronics Forum | Tue Apr 18 10:42:27 EDT 2006 | Carol Stirling
Hello All, Could someone offer suggestions to cure poor BGA reflow that is limited to the same area of the BGA and on one type of board only. The reflow has the look of "baseball caps" and is positioned such that it is the leading edge only that doe
Electronics Forum | Fri Apr 21 00:56:44 EDT 2006 | pavel_murtishev
Good morning, MPM AP25 we have is equipped with dedicated vacuum support only, no side snuggers. Also we had a lot of issues with fine pitch paste deposition due to this poor support. Vacuum support can�t fix wrapped boards properly causing a lot of
Electronics Forum | Tue May 02 13:57:21 EDT 2006 | patrickbruneel
What you can do is perforate the board holding rim by drilling holes of 0.6mm (similar to via's). This will reduce the mass and heatsinking capacity, allow excess flux drainage and facilitate convection heat contacting the board through the holes. Th
Electronics Forum | Thu May 04 10:29:40 EDT 2006 | Chunks
"Bending nozzles" "Changing dwell times" "Navels" (!!!!!!!!!??????????) And probably not taking responsibility when the poop hits the fan cause "you're just an operator". Not knowing your boards, but estimating your time scenario, I'd say you're sol
Electronics Forum | Thu May 18 14:14:57 EDT 2006 | samir
Sounds like your company will need to make a "sound business decision." Is this a contract that you guys really want to win? If yes, then Chunks is correct. Jump through hoops for this customer and "eat the cost" of rebuilding or repairing their b
Electronics Forum | Thu May 25 05:22:51 EDT 2006 | aj
Guys, We have an issue with a Board we are running at the moment. We have 3 BGAs on the board 1 Leadfree and 2 are not. We are running a Leaded Process and the LF part is not available Leaded. What do we do? I reckon that all we can do is try an
Electronics Forum | Mon Jun 05 14:35:17 EDT 2006 | marc
Yes.... stop checking on your process.... :) Seriously...if you cleaning the boards after I would suspect no issues. If your leaving the flux on the board (I suspect they are using quite a bit) then I would be concerned. Since the boards have al
Electronics Forum | Mon Jul 10 20:59:14 EDT 2006 | davef
Dave Try: * IPC-2221 - Generic Standard On Printed Board Design * IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards Our old [euphemistically] friend Earl Moon has written extensively on DFM. Look at his site: http://
Electronics Forum | Tue Jul 11 12:59:26 EDT 2006 | mattkehoe@sipad.com
We are trying to apply solder to boards with 80 microinches of electro plated hard gold. No components involved, just print 63/37 paste and reflow. The results are very poor on some boards, not so bad on others? Pictures at http://www.sipad.net/thick
Electronics Forum | Tue Jul 25 09:42:52 EDT 2006 | razor9114
Good morning, I got a question regarding Immersion Silver Board Finish. It has been imposed on us by our customer that we must manufacture PCB through the SMT process within 24 hours of breaking the seal on a bag of PCB containing Immersion Silver.
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