Electronics Forum | Tue May 03 09:15:44 EDT 2005 | py
Hi , I have a old stock of pcb(s), but we do not have the gerber files. anyone knows a soft to do that ?
Electronics Forum | Tue May 03 15:22:02 EDT 2005 | cuculi54986@yahoo.com
ScanCAD comes to mind. I don't have any experience with it but I have heard of it. I think it is designed to do what you are asking.
Electronics Forum | Fri May 13 13:36:45 EDT 2005 | russ
How does this scanner take care of inner layers, via hole/ pad dimensions and such
Electronics Forum | Fri May 13 14:23:44 EDT 2005 | Frank
Bill, If you are using a regular A3-sized scanner (roughly 12x16), how do you scan larger stencils or larger baords? Can you do multiple scans and merge the pictures? Frank
Electronics Forum | Sat May 07 04:28:51 EDT 2005 | grayman
try checking the speed/conveyor driver,encoder,comunication I/O Board system and lastly the program. If the driver is at fault replaced it do not repair it. If software try to load it again but make back up.
Electronics Forum | Tue May 10 14:27:14 EDT 2005 | amejia
The holes on the circuit board which need to be covered are very small and it is more time consuming to cut to size and place with kapton tape. Thanks for the feedback.
Electronics Forum | Tue May 10 16:53:21 EDT 2005 | jdengler
For dots this size I have applied a thin coat of Chemtronics CM8, let set 10 mins then waved. The preheaters finished the cure before the board reached the wave. You just have to drill into the heads of who applies the mask that thinner is better!
Electronics Forum | Tue May 10 17:50:08 EDT 2005 | davef
Consider: * Changing your temporary solder resist [TSR] to a light cure. * Contracting with your board fabricator to apply the TSR. * Gaining better thickness control of your application process by silk screening the current TSR. * Forcing more air c
Electronics Forum | Thu May 12 08:24:05 EDT 2005 | patrickbruneel
Amejia, If your application is strictly conformal coating and no heat is applied to the board, the product seal and peel would be the solution see link http://www.interfluxusa.com/misc.html This product solidifies immediately on cooling The only dra
Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto
This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.
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