Electronics Forum | Thu Jul 19 11:59:21 EDT 2007 | hussman
Phil is wrong. In the real world, we know that part mfgers have not changed every one of their parts to make them "high temp". They just changed the plating. Anyone who thinks otherwise, has never run a profile or touched a warm board coming out o
Electronics Forum | Wed Aug 08 17:50:22 EDT 2007 | flipit
X7R >Z5U,Y5V Greater means less likely to crack or in other words NP0 is better than X7R for crack resistance. Don't think that there is a set formula. There isn't! I cracked ceramic resonators at 0.050" from the board edge with CAB M2 and M3 dep
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
Electronics Forum | Mon Aug 13 10:51:14 EDT 2007 | davef
This sounds like sales-type teaser posting, but let's see what we get. When comparing convection to IR BGA rework stations, IR stations perform poorly when: * Evaluation board has no power and ground planes. Worst case PWB as IR energy from bottom h
Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics
This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of
Electronics Forum | Wed Aug 29 00:13:24 EDT 2007 | slthomas
The two factories I've worked at that ran Radial Lead inserter/sequencers were both building their own products and we were able to specify our own panelization guidelines. One-half inch rectangular frame on all boards. Our universal workboard hold
Electronics Forum | Tue Sep 04 15:08:51 EDT 2007 | floydf
We have a job that has through hole components on the top, and one 44 pin j leaded PLCC on the bottom. Presently we put the through hole parts in, run it throught the wave, dispense paste on the PLCC pads, and then apply hot air. Someone suggested we
Electronics Forum | Tue Sep 18 07:52:29 EDT 2007 | davef
Does the change from supplier to supplier as a result of: * Board definition? * Differences in processing at fabs? 3 Specification Fir Tree General Technical Specification 3a Design/Layout: * IPC-2221 * IPC-2222 3b PCB Fab: * IPC-6011 * IPC-6012 * I
Electronics Forum | Tue Sep 18 19:32:49 EDT 2007 | davef
Welcome Jimmy Let's mince words to help focus on the issues. When you say "QFP area solder paste shifted," do you mean: * Paste printed on land pattern perfectly, but moves after printing. * Paste printed off the land pattern, even though the stenci
Electronics Forum | Mon Oct 15 09:58:27 EDT 2007 | davef
Never heard of "special finger marker stickers" for checking wave parallelism. We assume that you're talking board-to-wave parallelism. We use a Durostone fixture with a thermalcouple [TC] in each far corner of the fixture (flush to the bottom of th
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