Electronics Forum: boarded (Page 1181 of 1642)

Moisture absorption in the solder paste

Electronics Forum | Tue Nov 08 20:58:49 EST 2005 | davef

We buy humidity as a potential cause of solder balls, but we're not biting on dewetting. Something else is causing that. Questions are: * What's the temperature and RH of your SMT production area? * What kind of paste are you using? [Some water was

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 11:26:23 EST 2005 | CW

How large of chip capacitor can we use reliably? I��ve heard they tend to crack. I��ve also heard if you pre heat the larger chip caps (1812 and above) before vapor phase reflow, they won��t crack. If I use 2 mil copper for a power supply board, a

IPC

Electronics Forum | Thu Nov 10 21:15:39 EST 2005 | davef

Years ago, there was discussion of making a "IPC-A-640" to define requirements for assemblies comprised of more than a circuit board assembly. We don't know what happened after that. As an alternative consider: Telcordia GR-78 - Generic Requiremen

Dip Soldering Advice

Electronics Forum | Sun Nov 13 21:23:03 EST 2005 | jaciesla

Hello, I am looking to change from hand soldering to a dip soldering method. The board is double sided (only one side has components though) and has all through hole components currently. I would just like to know if dip soldering would be the best c

Dip Soldering Advice

Electronics Forum | Mon Nov 14 08:57:14 EST 2005 | James

Hello, I am looking at a manual solder bath that the operator will dip the boards into. We looked at the cost of a wave machine but it is not in the budget for this year so we would like to go with the static bath method. I was hoping someone would b

Who should operate an AOI? operator or Inspector?

Electronics Forum | Wed Nov 16 20:53:17 EST 2005 | VS

Normally inspector is operating the verification station - such as checking the components found by AOI, feedback to the system about real defects and false calls, scanning barcode to find certain board, load data for the recipe and so on... Line ope

Inner Layer Separation from Barrel Wall - Too Much Heat?

Electronics Forum | Sun Nov 20 04:40:12 EST 2005 | KEN

I agree with Davef. If no evidence of gouging or pad damage exists thn I would suspect supplier issue. An easy test would be to load the hole with part and thermocouple and find out what your irons are capable of delivering. Unless you're solderin

How to prevent Bluetooth Module BGA short anybody?

Electronics Forum | Tue Nov 22 10:12:13 EST 2005 | stepheniii

Have you complained yet to MuRata? You are talking about the same bluetooth module, aren't you. I hope everybody having trouble with module complains to them. I don't believe they put all the cautions and warnings about reducing the deltaT on the da

How to prevent Bluetooth Module BGA short anybody?

Electronics Forum | Fri Nov 25 09:31:56 EST 2005 | davef

pyramus, First, search the fine SMTnet Archives for previous discussions on BGA shorts. Second, we're still not clear on the issue. * Is the problem with a BGA? If so, please describe the BGA, including any heat spreader * Is the problem with a uB

Lead free components in 62/36/2 paste prob.

Electronics Forum | Mon Nov 21 01:10:27 EST 2005 | mskler

We are facing the problem of dry soldering in chip capacitor 0603. When we told the Vender then he just told that we are using solder paste with 62/36/2 combination & the components are lead free so there is prob. of dry soldering. While we are usin


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