Electronics Forum | Fri Mar 23 14:13:20 EST 2001 | mnaddra
RW, I have Screened Adhesive on to several different assemblies and have found that when it is possible I get a much better result than with a dot deposition process (The green strength was greatly improved), the biggest issue I ran in to was the pr
Electronics Forum | Tue Apr 17 10:16:42 EDT 2001 | davef
Welcome to SMTnet. Awww, those assemblers are always whining about something. Just tell him to shut-up and build the blankin� boards. Jeesh!!! We used to have copious archives on the topic on SMTnet and our friend Brian is working his fingers t
Electronics Forum | Tue May 01 12:16:25 EDT 2001 | kaoni
I really appreciate your advice. Dave did not offer much in the way of real advice, his response was mostly diatribe. I am looking at visual inspection at this time as AOI might be overkill in my case. I believe that it, in combination with the machi
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Thu Jul 20 13:28:13 EDT 2000 | Bob Willis
On all the trials I have done I have made no changes to the stencil thickness or apertures than the normal changes we make for our process. I have not changed any thing in terms on volume of solder for more reliable joints. I fact I have not read any
Electronics Forum | Thu Jul 20 16:42:52 EDT 2000 | Bob Willis
Here are the details for the OU Lead-Free Project Introduction The Open University Solder Research Group aims to facilitate the implementation of lead-free solders by evaluating their mechanical properties, especially those which are influential to
Electronics Forum | Fri Jun 23 20:45:12 EDT 2000 | Lee
Hi Dave, You make a very good point. I think that the concern over lead is not so much in user's contact with the lead during the product's active life, but after its disposal. There is some valid concern over lead leaching out of circuit boards
Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon
My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would
Electronics Forum | Fri May 11 15:43:41 EDT 2001 | davef
More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the board (ie, thickness, type, solder ma
Electronics Forum | Mon May 14 22:24:11 EDT 2001 | davef
The time over liquidous of the profile seems short. But then again, who knows? Based on what you told us, I'm guessing at a board fabrication problem, either measling or delamination. Probably the former, rather than the latter. [Now, we remember
