Electronics Forum: boarded (Page 1311 of 1638)

Lead free tin copper only

Electronics Forum | Sun Feb 05 08:41:15 EST 2006 | Cmiller

Are you refering to reflow soldering or wave soldering? Brian, do you have any data to support that SAC305 is more reliable than Tin-Copper-Nickel? NEMI reccomended SAC type alloys for reflow and Tin-Copper for wave. See: http://circuitsassembly.

PACE TF1500 or 1700 BGA Rework feedback

Electronics Forum | Thu Feb 23 12:43:12 EST 2006 | MikeL

I am not a current user of PACE TF1500 however, I have evaluated it along with other systems before making a decision. Wasn't a good system for us. We could not achieve consistency / repeatable results from board to board. Basically, we found it t

Heat Sink for QFP

Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef

Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio

Typical SMT Machine changeover times?

Electronics Forum | Wed Mar 29 03:40:06 EST 2006 | Frank

The Juki 2060 can have both front and rear trolleys and you do not loose any feeder locations. My question was why can't the Assembleon put trolley on the rear? I recently visited a friend at a company that used a lot of Assembleon and compared run

Flux Residues In Lead Free Wave Soldering Process

Electronics Forum | Tue Mar 28 11:17:19 EST 2006 | smartasp

Thanks for the input Guys Yeah the not so knowledgable customer does not like to residues for cosmetic resons. The flux is for lead free process, of the no clean and water soluable type. We have explained to him that technically the residues do not

AIM SN100C Solder paste

Electronics Forum | Fri Apr 07 17:44:07 EDT 2006 | ratsalad

I still have half of a 500 g jar of this paste left. I'm going to give it another shot, but my first experience was not so wonderful. Everything was great until we reflowed it. Our profile matched AIM's recommendation, as far as I can see. The ch

CP4 of death

Electronics Forum | Thu Apr 13 10:05:47 EDT 2006 | daxman

Okay fellas...I posted awhile back regarding CP4 and CP6 placement issues. I think we may have figured it out. XO/YO and mark read positions were not correct. However, we have a new problem with the CP4-2. I was running the Fuji board, placing a s

AOI for defect detection at soldering process

Electronics Forum | Fri Apr 21 18:43:23 EDT 2006 | SD

Sorry, I have not read the article. However, I do have five years experience constantly tweaking an AOI system that ran ONE product! The strength of the machine was solder inspection. The biggest problem was component color variation and shadowing

Masking of PWBs prior to conformal coat

Electronics Forum | Fri Apr 21 17:46:29 EDT 2006 | SD

First of all, do not use kapton tape! It tends to cause a dewetting effect around the tape. A call to Humiseal will explain why. There's not really a blanket answer to your question.... Removing cured liquid mask can often result in a fillet ef

Water Soluble vs. No Clean

Electronics Forum | Tue May 02 18:15:21 EDT 2006 | Mike Konrad

We manufacturer cleaning equipment (full disclosure) so, our answer may seem self-serving. The facts however are accurate and relevant so here I go� Changing from an OA (water soluble) flux to a no-clean flux makes sense. After all, even die-hard


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