Electronics Forum: boarded (Page 401 of 1642)

Re: PCB blister(delamination)

Electronics Forum | Thu Jul 09 11:20:24 EDT 1998 | Justin Medernach

| I am looking for a little enlightement with an issue that we have been seeing. We have printed curcuit board with multilayer and HAL finished. | After reflow soldering, we have often "blister phenomenon". | Our reflow profile is normal. Factory

Re: Excess solder on pins

Electronics Forum | Wed Jul 22 15:05:31 EDT 1998 | Dave F

| | | | We are wave soldering a board having 24 similar thru hole connectors on it, using a wave soldering pallet. The problem is that one particular pin of connector in around 6-9 connectors get excess solder on the bottom side. I have tried all

Re: Why ask why? Bud Dry After DI? My, my, my...

Electronics Forum | Mon Jul 06 19:35:08 EDT 1998 | Steve Gregory

Hey Dave... The only reason I can think of wanting the boards good and dry after the wash is just what you've listed...power-up. I had some boards that went right into ICT right after the cleaner but still had a little water in the right angle c

Re: Gold Immersion Solder Joints

Electronics Forum | Fri Jul 10 14:20:24 EDT 1998 | Bob Willis

Yes bright shiny joints are a myth as many people like dull joints as they are easier to inspect due to reduced reflection of light. The difference you are seeing in the joints is more likly to be a surface effect, flux or just you think its differen

Gold boards

Electronics Forum | Wed Jul 01 10:49:01 EDT 1998 | Richard Jackson

I'm having a problem getting good reflow on gold sufaced boards. The profile looks good and I have adjusted it both hotter and colder and adjusted the various times ( soak, reflow ) to no avail. What realy gets me Is that a month ago we built some go

Re: printing

Electronics Forum | Mon Jun 29 13:38:20 EDT 1998 | Russ Miculich

| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Brian: As Justin says - the issues are many. However, a good start would be to run at 0.75

Re: straddle mount connectors

Electronics Forum | Fri Jun 26 19:59:07 EDT 1998 | Scott McKee

| can any body help on assembling straddle mount connectors on to a board? for information on the connector - it is a berg micropak connector 1. You need a fixture to insure the pins don't bend while inserting them on the board, coplanarity is a re

Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 13:51:57 EDT 1998 | Dave F

Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, opens

turbulent wave restrictions

Electronics Forum | Thu May 07 12:29:17 EDT 1998 | Rob Williams

I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am h

Re: Bottom side bridging

Electronics Forum | Fri Apr 10 15:59:51 EDT 1998 | Justin Medernach

| We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The


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