Electronics Forum | Thu Mar 19 03:07:31 EDT 2020 | weglimir
We have DEK265 and a problem with few projects. Normally it works great, but sometimes we have an issue with Alignment out of range error. Currently we have a project where after fiducials configuration in step mode printer shows an error : Align
Electronics Forum | Tue Aug 18 20:57:15 EDT 2020 | dwl
Specs like beam voltage, current and focal point size are important considerations for image quality and you can spend hours going down the rabbit hole learning about them. Fundamentally, what really matters is if you can get an image clear enough to
Electronics Forum | Thu Oct 29 14:54:26 EDT 2020 | emeto
The best way to measure is by money made(quality product and minimal rework). I worked for a company that asked me to achieve building 100 boards/week for an assembly. A year later they were unhappy that we don't hit 150 boards/day of the same board
Electronics Forum | Thu Dec 09 12:29:39 EST 2021 | stephendo
With the bottom followed by the top set up, how do you even come close to balancing that? For a lot of boards that I have seen you would need five or more top lines just to handle one bottom line. Or have the bottom line on a very low duty cycle. B
Electronics Forum | Mon Jan 10 03:45:23 EST 2022 | proy
YES there is an IPC target/acceptable spec In general terms the barrel thickness in the hole should be 1 mil (thou). IPC has an allowable limit lower around .75 with some other factors. I have been checking barrel plating on all incoming boards since
Electronics Forum | Fri Apr 29 23:57:24 EDT 2022 | auriga2001
I ran a SMT production line with and without SPI. I was also charged with gathering the time and defect metrics when we got our new SPI machine, comparing before and after implementation. It saved time on the printer because it didn't have to handle
Electronics Forum | Sat Jul 23 02:16:52 EDT 2022 | poly
Is there are reason for going for larger (or smaller) boards when designing panels for use with a chain conveyor oven? My panels range from 0.6mm 2 layer (for touch with hatched ground) to 1.6mm 4 layer. I'm planning to go for smaller panels to reduc
Electronics Forum | Wed Oct 19 07:04:06 EDT 2022 | winston_one
If any changes in design is not possible and you have to solder it, it's a real headache, I know... I see only 3 options here that you can try consiquently: 1) Accurately profile the board and optimize a profile (go to lower limit of process windo
Electronics Forum | Thu Nov 03 02:16:55 EDT 2022 | spacecase
Hey I'm having an issue with a samsung 421f component placer. The machine is fine on the first 5 boards then on the 6th or so it just throws them wherever. The problem is the smallest flat components start sticking to the nozzle even after hitting th
Electronics Forum | Wed May 03 13:34:04 EDT 2023 | proceng1
When we get a bad print at SMT, the operator uses the alcohol wipes and wipes the paste off the board. Then they use compressed air and another wipe. In most cases this is sufficient. Most vias are tented, but there still remains some solder sphere
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