Electronics Forum | Wed Jun 22 10:12:31 EDT 2005 | slthomas
I don't know how your printer could match the board's alignment to the stencil if they aren't. If you don't have fids on both board and stencil that match you'd have to use pads, but then you've got apertures thrown in to the mix. If that's the sit
Electronics Forum | Thu Jun 23 08:58:00 EDT 2005 | Irene Taylor
We are defining a new assembly process for a double sided card that has 26 BGAs on the top side and 14 BGAs on the bottom side. We currently have one double sided BGA board with one BGA per side and have to epoxy one BGA (35mm X 35mm - 352 ball count
Electronics Forum | Thu Jun 23 10:43:40 EDT 2005 | davef
It wouldn't surprise us [too much] if this part wouldn't stay for second sided reflow. * If the lead contact area to weight is less than 44 gm / inch^2 [we know the units are goofy, but convient], it'll stay. * Alternately, just run a scrap board a
Electronics Forum | Fri Jun 24 07:02:35 EDT 2005 | davef
Problem 1: Solder shortage * Stencil aperatures [except the heat slug] should be 1:1 with the board. * Stencil should be 5 thou thick laser cut. * Board should be 1:1 with the component * Print should look good. Problem #2: Bad connection between p
Electronics Forum | Sat Jul 09 11:31:14 EDT 2005 | techvet99
I have several circuit boards (about 14" by 16" in size) that I recently acquired and am trying to repair. One problem is that the former owner painted (spray paint I think) the word "TEST" in big red letters covering most of the solder side of the
Electronics Forum | Fri Jul 15 06:50:02 EDT 2005 | Rob
It looks like the 330 Convection & the GF120 ovens would really stuggle to do lead free, with 3 zones (the 330 has 3 top, 1 bottom). Can't comment on the 545 oven, you'll have to get them to run profiles with a selection of your boards & check on
Electronics Forum | Fri Jul 15 16:50:04 EDT 2005 | davef
Few of us here on SMTnet fabricate our bare boards. Most of us are assemblers. So, the solderability of the connections of our boards is a BIG issue with us. Our suppliers protect the solderability of the copper by coating the copper to limit the
Electronics Forum | Tue Jul 19 05:16:34 EDT 2005 | aj
Hi, I looked at the pictures and it looks as if it should be a straight forward solution..but obviously not. I would focus on the stencil/print more than placement machine. The placement machine simply places the part on the board!#(just one thing
Electronics Forum | Thu Jul 21 22:22:50 EDT 2005 | Ken
Hey, Peter. back in the mid 90's I reversed engineered their drive system because of a dispute over print speed malfunctions. I prooved correct that they had made published claims about their drive topology that were not true. They agreed to redes
Electronics Forum | Wed Jul 27 03:50:51 EDT 2005 | aj
Crishan, I am not familiar with the machine you mentioned. Do you use selective solder pallets through a wave process or is the machine a selective soldering machine (ie. where the board is moved to the solder fountain) No matter what the process
