Electronics Forum | Tue Apr 11 12:40:47 EDT 2006 | Chunks
Depending on model and/or series, each one has it's own specific manufacturing guidelines you must meet in order to get a successful solder joint. Then you must couple that to what your soldering process is. Assuming you are talking all thru-hole,
Electronics Forum | Tue Apr 25 12:21:53 EDT 2006 | jdumont
...and after you remove/replace the BGA you send the entire board back through the reflow oven??...that doesnt sound like a very good idea...
Electronics Forum | Thu Apr 13 08:18:46 EDT 2006 | davef
Do a FITR analysis of this white material to help direct you in eliminating the choices. What do your paste and board suppliers say?
Electronics Forum | Fri Apr 14 12:10:06 EDT 2006 | Nevets
Looking into options besides routing for a .032" thick board with components located near edges. Has anyone ever tried water jet cutting or other technologies for a high volume, high mix environment.
Electronics Forum | Thu May 04 15:33:05 EDT 2006 | Chunks
Hi Mike, What piece of equipment do you use? I've never heard of using a water jet to route PC boards before, but would like to do some investigating before I buy another traditional router. And why only high volumes?
Electronics Forum | Tue Apr 18 10:08:51 EDT 2006 | russ
We use materials such as G10, durapol, or FR4. We put a lot of holes in the fixtures so that only enough material is left to support the board during reflow to prevent sag/ warp or whatever. We also try and keep all bot side material in unpopulated
Electronics Forum | Wed Apr 26 09:15:23 EDT 2006 | Carol Stirling
That would be correct. Some others call it `Head in Pillow'. The BGA balls are 63/37 and the board it's mounting to is HASL.
Electronics Forum | Wed Apr 26 10:33:57 EDT 2006 | Carol Stirling
Hi Russ, The board was ran in two orientations but with poor results. The same area of the BGA failed. I was advised today that the Process Engineer here has come to the conclusion the defect is Pick and Place machine oriented, not a process/pro
Electronics Forum | Fri Apr 21 12:19:59 EDT 2006 | fastek
A lot has changed since the AP25 was designed. What looks like a bad design today was cutting edge 10-12 years ago.
Electronics Forum | Fri Apr 21 09:03:59 EDT 2006 | choppy
I guess the first thing to look at is the temperature. We had to heat more for QFP256 on sample boards and we saw discoloration on some small parts. Just try to sense around when profiling to see what's there.
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