Electronics Forum: bonded (Page 1 of 64)

Die bonded at an angle in a QFN component

Electronics Forum | Wed Jul 29 16:04:03 EDT 2020 | emeto

Very interesting. Looking at the wire bonding, it seems that it is all normal.

Die bonded at an angle in a QFN component

Electronics Forum | Wed Jul 15 08:36:41 EDT 2020 | dproldan

Using a X-Rays machine, we have noticed that one component we are using has the silicon die bonded at an angle in the package. Have you ever seen something like this? I'm not sure if it's intentional or a manufacturing error.

Die bonded at an angle in a QFN component

Electronics Forum | Fri Jul 17 21:54:18 EDT 2020 | davef

That is unusual. Is it a once-off or SOP for that part?

Die bonded at an angle in a QFN component

Electronics Forum | Wed Jul 29 14:55:41 EDT 2020 | philc

Maybe check with the manufacturer? I am sure they would know if this was normal. And does the PCB function as expected? If it does, maybe not an issue....

Plating for aluminum wire bonding

Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini

Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.

temperature induced IMC in wire bonds?

Electronics Forum | Tue Nov 15 11:21:32 EST 2005 | davef

Which is it: * Wire bonds don't stick when bonded * Wire bonds fall off, or break during service

COB Issue's (Non-Sticking)

Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef

Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the


Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef

Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin

Au Wire bonding failure

Electronics Forum | Fri Dec 16 13:37:52 EST 2016 | edhare

Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of

Wirebond issues near SM

Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong

Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c

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