Electronics Forum | Wed Jul 29 16:04:03 EDT 2020 | emeto
Very interesting. Looking at the wire bonding, it seems that it is all normal.
Electronics Forum | Wed Jul 15 08:36:41 EDT 2020 | dproldan
Using a X-Rays machine, we have noticed that one component we are using has the silicon die bonded at an angle in the package. Have you ever seen something like this? I'm not sure if it's intentional or a manufacturing error.
Electronics Forum | Fri Jul 17 21:54:18 EDT 2020 | davef
That is unusual. Is it a once-off or SOP for that part?
Electronics Forum | Wed Jul 29 14:55:41 EDT 2020 | philc
Maybe check with the manufacturer? I am sure they would know if this was normal. And does the PCB function as expected? If it does, maybe not an issue....
Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini
Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.
Electronics Forum | Tue Nov 15 11:21:32 EST 2005 | davef
Which is it: * Wire bonds don't stick when bonded * Wire bonds fall off, or break during service
Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef
Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the
Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef
Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin
Electronics Forum | Fri Dec 16 13:37:52 EST 2016 | edhare
Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of
Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong
Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c