Electronics Forum | Tue Mar 13 20:47:39 EDT 2018 | davef
I think of palladium coated copper with gold flash (CuPdAu) as bond wire used in chip attach. Look here: https://www.heraeus.com/media/media/het/doc_het/products_and_solutions_het_documents/bonding_wires_documents/fact_sheets/Factsheet_PdFlash.pdf
Electronics Forum | Thu Nov 29 03:19:46 EST 2018 | robl
You may want to look at a product called place & bond underfilm. It is essentially a SMD tape and reel placed pad that acts like underfill when going through reflow. I got some samples from an APP tech day and had a play and it bonds very well. Y
Electronics Forum | Fri Jun 01 10:52:37 EDT 2012 | blnorman
Neither the Omega meter nor the IC are officially "destructive" tests, but everywhere I worked we treated them that way. The boards were scrapped after the test. The Omega meter can be tested at elevated temps, but the IC sample is extracted at ele
Electronics Forum | Thu Jul 04 23:17:24 EDT 2019 | 123456789
Today we will talk some other problems you may meet in the wedge bonding work. If you have any other supplement or suggestion, welcome to leave us message. Appear welding spot indentation on the frame, what's the causes? How to solve? 1.The Wedge’s
Electronics Forum | Fri Aug 17 11:55:31 EDT 2001 | davef
5uin. Your nickel thickness is fine. Although if you wanted to trade costs, consider giving-up nickel to 150uin thickness, while increasing the gold thickness. Gold over electroless nickel creates brittle joints because of phosphorous in the nicke
Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia
Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But
Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber
There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det
Electronics Forum | Tue Apr 17 10:17:10 EDT 2001 | genny
Hi, ENIG finish is the same reason I came to this forum for the first time a few months ago. I found a bunch of useful information by searching the archives. Check it out. ENIG has some good properties like flatness, and the process control has i
Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean
Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de
Electronics Forum | Thu Dec 03 11:11:01 EST 1998 | David Pinsky
| Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | Any in
